Edward Yi Chang

Prof. Dr. Edward Yi Chang

Dean of International College of Semiconductor Technology, National Yang Ming Chiao Tung University, Hsinchu, Taiwan

Research Focus & Metrics

Academic Career Length

32Years (1995-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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4 March 2015 in Physica Status Solidi (RRL) – Rapid Research Letters
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Journal Article
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YHYen-Teng Ho
Yen-Teng Ho
CMChun‐Hao Ma
Chun‐Hao Ma
TLTien‐Tung Luong
Tien‐Tung Luong
LWLin‐Lung Wei
Lin‐Lung Wei
TYTzu‐Chun Yen
Tzu‐Chun Yen
Edward Yi ChangEdward Yi Chang
Edward Yi Chang

22 February 2021 in Applied Physics Letters
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STSung-Lin Tsai
Sung-Lin Tsai
THTakuya Hoshii
Takuya Hoshii
HWHitoshi Wakabayashi
Hitoshi Wakabayashi
KTKazuo Tsutsui
Kazuo Tsutsui
TCTien-Kan Chung
Tien-Kan Chung
Kuniyuki KakushimaKuniyuki Kakushima
Kuniyuki Kakushima
Crystallographic characterization and the ferroelectric properties of 50 nm-thick sputter-deposited Al0.78Sc0.22N films deposited at room temperature (RT) and 400 °C are investigated. c-axis oriented growths were confirmed by x-ray diffraction patterns with rocking curve measurements for both samples. Al0.78Sc0.22N films were found to grow in the c-axis direction and showed poling-free ferroelectric properties, which are advantageous for practical memory and piezoelectric applications. Although the metal-ferroelectric-metal (MFM) capacitors represent low switching cycle endurance, MFM capacitors revealed remnant polarization (Pr) of 70 μC/cm2 and 113 μC/cm2 for RT- and 400 °C-deposited samples, respectively. Ferroelectric films with low-temperature process capability can open a wide range of applications.

27 September 2021 in Micromachines
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LHLung-Hsing Hsu
Lung-Hsing Hsu
YLYung-Yu Lai
Yung-Yu Lai
PTP. Tu
P. Tu
CLCatherine Langpoklakpam
Catherine Langpoklakpam
YCYa-Ting Chang
Ya-Ting Chang
Edward Yi ChangEdward Yi Chang
Edward Yi Chang
GaN HEMT has attracted a lot of attention in recent years owing to its wide applications from the high-frequency power amplifier to the high voltage devices used in power electronic systems. Development of GaN HEMT on Si-based substrate is currently the main focus of the industry to reduce the cost as well as to integrate GaN with Si-based components. However, the direct growth of GaN on Si has the challenge of high defect density that compromises the performance, reliability, and yield. Defects are typically nucleated at the GaN/Si heterointerface due to both lattice and thermal mismatches between GaN and Si. In this article, we will review the current status of GaN on Si in terms of epitaxy and device performances in high frequency and high-power applications. Recently, different substrate structures including silicon-on-insulator (SOI) and engineered poly-AlN (QST®) are introduced to enhance the epitaxy quality by reducing the mismatches. We will discuss the development and potential benefit of these novel substrates. Moreover, SOI may provide a path to enable the integration of GaN with Si CMOS. Finally, the recent development of 3D hetero-integration technology to combine GaN technology and CMOS is also illustrated.

14 March 2008 in Proceedings of the IEEE
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THThomas S. Huang
Thomas S. Huang
CDCharlie K. Dagli
Charlie K. Dagli
SRShyamsundar Rajaram
Shyamsundar Rajaram
Edward Yi ChangEdward Yi Chang
Edward Yi Chang
MMMichael I. Mandel
Michael I. Mandel
DEDaniel P. W. Ellis
Daniel P. W. Ellis
As the first decade of the 21st century comes to a close, growth in multimedia delivery infrastructure and public demand for applications built on this backbone are converging like never before. The push towards reaching truly interactive multimedia technologies becomes stronger as our media consumption paradigms continue to change. In this paper, we profile a technology leading the way in this revolution: active learning. Active learning is a strategy that helps alleviate challenges inherent in multimedia information retrieval through user interaction. We show how active learning is ideally suited for the multimedia information retrieval problem by giving an overview of the paradigm and component technologies used with special attention given to the application scenarios in which these technologies are useful. Finally, we give insight into the future of this growing field and how it fits into the larger context of multimedia information retrieval.

11 April 2018 in IEEE Electron Device Letters
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CWChia-Hsun Wu
Chia-Hsun Wu
PHPing-Cheng Han
Ping-Cheng Han
SLShih-Chien Liu
Shih-Chien Liu
THTing-En Hsieh
Ting-En Hsieh
FLFranky Juanda Lumbantoruan
Franky Juanda Lumbantoruan
Edward Yi ChangEdward Yi Chang
Edward Yi Chang
A GaN metal-insulator-semiconductor-high electron mobility transistor (HEMT) using hybrid ferroelectric charge trap gate stack (FEG-HEMT) is demonstrated for normally-OFF operation. The ferroelectric (FE) polarization increases the number of trapped charges in the HfON charge trapping layer, leading to high positive threshold voltage (V th ) shift for the normally-OFF device. Besides, under the positive bias temperature instability (PBTI) test, the internal electric field induced by FE polarization causes smoother slope of the conduction band in FE gate stack, resulting in better V th stability. With the proposed hybrid FE charge trap gate stack, the device exhibits a high V th of +2.71 V at I Dh = 1μA/mm, a high maximum current density of 820 mA/mm and low on-resistance (R ON ) of 11.1 Ω · mm. The FE device also shows good V th -temperature stability compared to the non-FE device results. Besides, a high current device with 40 A is also fabricated in this letter to demonstrate the feasibility of the proposed FEG-HEMT device for high power device application.

1 January 2010 in Journal of the Electrochemical Society
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YWYuen-Yee Wong
Yuen-Yee Wong
Edward Yi ChangEdward Yi Chang
Edward Yi Chang
TYTsung-Hsi Yang
Tsung-Hsi Yang
JCJet-Rung Chang
Jet-Rung Chang
JKJui-Tai Ku
Jui-Tai Ku
KLKung-Liang Lin
Kung-Liang Lin
The role played by different types of threading dislocations (TDs) on the electrical properties of AlGaN/GaN heterostructure grown by plasma-assisted molecular beam epitaxy (MBE) was investigated. Samples with different defect structures and densities were prepared and measurements were taken from the same sample to study the correlative behavior of various TDs. From the Hall measurement, the electron mobility in two-dimensional electron gas channel was mainly controlled by the edge dislocation, which has a dominant amount in the material. The edge TDs acted as Coulomb scattering centers inside the channel and reduces the carrier mobility and increased its resistance. Screw TDs played a much significant role than edge TDs in determining the reverse-bias leakage current of Schottky barrier diodes. Leakage current is affected slightly by the reduction of free carrier density in the channel for samples with a higher edge TD density, but screw TD, which acted as the current leakage path, was more deleterious to the reverse-bias leakage current of AlGaN/GaN structure.