In high-reliability applications, the health condition of the MEMS gyroscope needs to be known in real time to ensure that the system does not fail due to the wrong output signal. Because the MEMS gyroscope self-test based on the principle of electrostatic force cannot be performed during the working state. We propose that by monitoring the quadrature error signal of the MEMS gyroscope in real time, an online self-test of the MEMS gyroscope can be realized. The correlation between the gyroscope’s quadrature error amplitude signal and the gyroscope scale factor and bias was theoretically analyzed. Based on the sixteen-sided cobweb-like MEMS gyroscope, the real-time built-in self-test (BIST) method of the MEMS gyroscope based on the quadrature error signal was verified. By artificially setting the control signal of the gyroscope to zero, we imitated several scenarios where the gyroscope malfunctioned. Moreover, a mechanical impact table was used to impact the gyroscope. After a 6000 g shock, the gyroscope scale factor, bias, and quadrature error amplitude changed by −1.02%, −5.76%, and −3.74%, respectively, compared to before the impact. The gyroscope failed after a 10,000 g impact, and the quadrature error amplitude changed −99.82% compared to before the impact. The experimental results show that, when the amplitude of the quadrature error signal seriously deviates from the original value, it can be determined that the gyroscope output signal is invalid.

Processing errors can result in an asymmetric stiffness distribution within a microelectromechanical system (MEMS) disk resonator gyroscope (DRG) and thereby cause a mode mismatch and reduce the mechanical sensitivity and closed-loop scale factor stability. This paper proposes an automatic mode-matching method that utilizes mode reversal to obtain the true resonant frequency of the operating state of a gyroscope for high-precision matching. This method constructs a gyroscope control system that contains a drive closed loop, sense force-to-rebalance (FTR) closed loop, and quadrature error correction closed loop. After the gyroscope was powered on and started up, the x- and y-axes were quickly switched to obtain the resonant frequencies of the two axes through a phase-locked loop (PLL), and the x-axis tuning voltage was automatically adjusted to match the two-axis frequency. The experimental results show that the method takes only 5 s to execute, the frequency matching accuracy reaches 0.01 Hz, the matching state can be maintained in the temperature range of −20 to 60 °C, and the fluctuation of the frequency split does not exceed 0.005 Hz.

This paper presents a silicon-based wafer-level vacuum packaging platform with a monolithically integrated micro-oven. This system provides vacuum and constant temperature operating conditions to improve the performance of resonant micro-electro-mechanical systems (MEMS) devices. Based on a three-layer wafer-level vacuum packaging process, the platform integrates a silicon thermistor, a thermal isolation structure, and a heater with the addition of a mask and an additional silicon wafer. This wafer-level vacuum-packaging platform achieved a vacuum level of approximately 6 mTorr. Due to the micro-oven, the temperature coefficient of the resonant frequency for the MEMS resonator was reduced by 48 times, and the temperature coefficient of the quality factor was reduced 19 times within the temperature range of −40 °C to 80 °C. The heater of the micro-oven consumed about 364 mW of power when the ambient temperature was −40 °C and the temperature controlled by the micro-oven was 100 °C. This method enables the wafer-level integration of the thermistor, thermal isolation structure, heater, and vacuum-packaged resonator, offering advantages such as low cost, efficient batch production, and high performance.

This paper reports the design, fabrication, and characterization of a MEMS capacitive accelerometer with an asymmetrical comb finger arrangement. By optimizing the ratio of the gaps of a rotor finger to its two adjacent stator fingers, the sensitivity of the accelerometer is maximized for the same comb finger area. With the fingers’ length, width, and depth at 120 μm, 4 μm, and 45 μm, respectively, the optimized finger gap ratio is 2.5. The area of the proof mass is 750 μm × 560 μm, which leads to a theoretical thermomechanical noise of 9 μg/√Hz. The accelerometer has been fabricated using a modified silicon-on-glass (SOG) process, in which a groove is pre-etched into the glass to hold the metal electrode. This SOG process greatly improves the silicon-to-glass bonding yield. The measurement results show that the resonant frequency of the accelerometer is about 2.05 kHz, the noise floor is 28 μg/√Hz, and the nonlinearity is less than 0.5%.