Quality factor is one of the most important parameters for a MEMS resonator. Most MEMS resonators are dominated by thermoelastic dissipation (TED). This paper demonstrates that the TED in a disk resonator that is made of (111) single-crystal silicon is surpassed by clamping loss. The stiffness-mass decoupling design method, combined with reducing the beam width, was used to engineer high Q_TED. Experiments show that Q of the (111) disk resonator have an upper boundary that is determined by the clamping loss caused by the unbalanced out-of-plane displacement. The origin of the out-of-plane displacement is explained by theory and simulation.

The MEMS scanning micromirror requires angle sensors to provide real-time angle feedback during operation, ensuring a stable and accurate deflection of the micromirror. This paper proposes a method for integrating piezoresistive sensors on the torsion axis of electrostatic MEMS micromirrors to detect the deflection angle. The design uses a multi-layer bonding process to realize a vertical comb-driven structure. The device structure is designed as a double-layer structure, in which the top layer is the ground layer and integrates with piezoresistive sensor. This approach avoids crosstalk between the applied drive voltage and the piezoresistive sensor. This design also optimizes the sensor’s size, improving sensitivity. A MEMS two-dimensional (2D) scanning micromirror with a 1 mm mirror diameter was designed and fabricated. The test results indicated that, in a vacuum environment, the torsional resonance frequencies of the micromirror’s fast axis and slow axis were 17.68 kHz and 2.225 kHz, respectively. When driving voltages of 33 V and 40 V were applied to the fast axis and slow axis of the micromirror, the corresponding optical scanning angles were 55° and 45°, respectively. The piezoresistive sensor effectively detects the micromirror’s deflection state, and optimizing the sensor’s size achieved a sensitivity of 13.87 mV/V/°. The output voltage of the piezoresistive sensor shows a good linear relationship with the micromirror’s deflection angle, enabling closed-loop feedback control of the electrostatic MEMS micromirror.

This paper proposes a new multiple folded-beam disk resonator whose thermoelastic quality factor is significantly improved by appropriately reducing the beam width and introducing integral-designed lumped masses. The quality factor of the fabricated resonator with (100) single crystal silicon reaches 710 k, proving to be a record in silicon disk resonators. Meanwhile, a small initial frequency split of the order-3 working modes endows the resonator with great potential for microelectromechanical systems (MEMS) gyroscopes application. Moreover, the experimental quality factor of resonators with different beam widths and relevant temperature experiment indicate that the dominating damping mechanism of the multiple folded-beam disk resonator is no longer thermoelastic damping.

This paper presents a silicon-based wafer-level vacuum packaging platform with a monolithically integrated micro-oven. This system provides vacuum and constant temperature operating conditions to improve the performance of resonant micro-electro-mechanical systems (MEMS) devices. Based on a three-layer wafer-level vacuum packaging process, the platform integrates a silicon thermistor, a thermal isolation structure, and a heater with the addition of a mask and an additional silicon wafer. This wafer-level vacuum-packaging platform achieved a vacuum level of approximately 6 mTorr. Due to the micro-oven, the temperature coefficient of the resonant frequency for the MEMS resonator was reduced by 48 times, and the temperature coefficient of the quality factor was reduced 19 times within the temperature range of −40 °C to 80 °C. The heater of the micro-oven consumed about 364 mW of power when the ambient temperature was −40 °C and the temperature controlled by the micro-oven was 100 °C. This method enables the wafer-level integration of the thermistor, thermal isolation structure, heater, and vacuum-packaged resonator, offering advantages such as low cost, efficient batch production, and high performance.

Liquid gallium (Ga) enables low-temperature transient liquid phase bonding (TLPB), but optimizing microstructure and joint performance remains challenging. Here, we developed a copper (Cu)-powder/liquid-Ga composite paste for Cu/Cu interconnects and systematically studied the effects on the interconnect joint performance of Cu powder particle size (Cu_PS, 10–20, 20–30 and 30–40 μm) and Cu mass fraction (Cu_MF, 10–30 wt%). The microstructure, electrical conductivity, and shear strength of the joint were evaluated, followed by an assessment of bonding temperature, pressure, and time. Under bonding conditions of 220 °C, 5 MPa and 720 min, a dense intermetallic compound (IMC) microstructure predominantly composed of Cu₉Ga₄ and CuGa₂ was formed, yielding an electrical conductivity of approximately 1.1 × 10⁷ S·m⁻¹ and a shear strength of 52.2 MPa, thereby achieving a synergistic optimization of electrical and mechanical properties; even under rapid bonding conditions of 220 °C, 5 MPa and 1 min, the joint still attained a shear strength of 39.2 MPa, demonstrating the potential of this process for high-efficiency, short-time interconnection applications. These results show that adjusting the composite paste formulation and dosage enables Cu–Ga TLPB joints that combine high conductivity with robust mechanical integrity for advanced packaging.

Correction for ‘Heterogeneous integration of 8-inch LiNbO₃ films for second harmonic generation’ by Yong Wang et al., J. Mater. Chem. C, 2025, https://doi.org/10.1039/d5tc01952d.