In this study, the friction and wear characteristics of polydimethylsiloxane (PDMS) were evaluated when using lubricants created by adding surfactants at various ratios to deionized (DI) water. When pure DI water is used as a lubricant, the repulsion of water from the hydrophobic PDMS surface is large and the interfacial affinity is low; thus, the lubrication properties cannot be significantly improved. However, when a lubricant with a surfactant is added to DI water, the interfacial affinity with the PDMS surface increases to form a lubricating film, and the friction coefficient is greatly reduced. In this study, under dry and pure DI water conditions, severe wear tracks were formed on the PDMS surface after 10,000 cycles of reciprocating sliding motion under a vertical load of 100 mN, whereas in the case of the surfactant-based and water-based lubricant, no severe wear tracks occurred. The friction and wear characteristics of the PDMS were evaluated by increasing the normal loads and sliding cycles with a water-based lubricant containing 1 wt % surfactant. Under normal loads of 300 mN and 500 mN, only minor scratches occurred on the PDMS surface up to 10,000 and 100,000 cycles, respectively, but after 300,000 cycles, very severe pit wear tracks occurred.

Pt-nanoparticle (NP)-alloyed Sn-58Bi solders were reacted with electroless nickel-immersion gold (ENIG) and electroless nickel-electroless palladium-immersion gold (ENEPIG) surface finishes. We investigated formation of intermetallic compounds (IMCs) and their diffusion barrier properties at reaction interfaces as functions of Pt NP content in the composite solders and duration of solid-state aging at 100 °C. At Sn-58Bi-xPt/ENIG interfaces, typical Ni₃Sn₄/Ni₃P(P-rich layer) microstructure was formed. With the large consumption of the Ni-P layer, the Ni-P and Cu layers were intermixed and Cu atoms spread over the composite solder after 500 h of aging. By contrast, a (Pd,Ni)Sn₄/thin Ni₃Sn₄ microstructure was observed at the Sn-58Bi-xPt/ENEPIG interfaces. The (Pd,Ni)Sn₄ IMC effectively suppressed the consumption of the Ni-P layer and Ni₃Sn₄ growth, functioning as a good diffusion barrier. Therefore, the Sn-58Bi-xPt/ENEPIG joint survived 500 h of aging without microstructural degradation. Based on the experimental results and analysis of this study, Sn-58Bi-0.05Pt/ENEPIG is suggested as the optimum combination for future low-temperature soldering systems.

Liquid metals, such as Ga and eutectic Ga-In, have been extensively studied for various applications, including flexible and wearable devices. For applying liquid metal to electronic devices, interconnection with the various metal electrodes currently in use, and verifying their mechanical reliability are essential. Here, detailed investigations of the formation and growth of intermetallic compounds (IMCs) during the reactions between liquid Ga and solid nickel were conducted. Ga and Ni were reacted at 250, 300, and 350 °C for 10–240 min. The IMC double layer observed after the reactions contained a Ga₇Ni₃ bottom layer formed during the reactions, and a Ga_xNi top layer (with 89–95 at.% of Ga) precipitated during cooling. Numerous empty channels exist between the rod-type Ga₇Ni₃ IMCs. Ga₇Ni₃ growth occurred only in the vertical direction, without lateral coarsening and merging between the rods. The time exponents were measured at 1.1–1.5, implying that the reaction kinetics were near-interface reaction-controlled. The activation energy for Ga₇Ni₃ growth was determined as 49.1 kJ/mol. The experimental results of the Ga-Ni reaction study are expected to provide important information for incorporating liquid metals into electronic devices in the future.

In this study, intense pulsed light (IPL) soldering was employed on Sn-58Bi solder pastes with two distinct particle sizes (T3: 25–45 μm and T9: 1–8 μm) to investigate the correlation between the solder microstructure and mechanical properties as a function of IPL irradiation times. During IPL soldering, a gradual transition from an immature to a refined to a coarsened microstructure was observed in the solder, impacting its mechanical strength (hardness), which initially exhibited a slight increase followed by a subsequent decrease. It is noted that hardness measurements taken during the immature stage may exhibit slight deviations from the Hall–Petch relationship. Experimental findings revealed that as the number of IPL irradiation sessions increased, solder particles progressively coalesced, forming a unified mass after 30 sessions. Subsequently, after 30–40 IPL sessions, notable voids were observed within the T3 solder, while fewer voids were detected at the T9-ENIG interface. Following IPL soldering, a thin layered structure of Ni₃Sn₄ intermetallic compound (IMC) was observed at the Sn-58Bi/ENIG interface. In contrast, reflow soldering resulted in the abundant formation of rod-shaped Ni₃Sn₄ IMCs not only at the reaction interface but also within the solder bulk, accompanied by the notable presence of a P-rich layer beneath the IMC.

In this study, the friction and wear characteristics of graphene coatings were evaluated using lubricants with various ratios of graphene ink to deionized (DI) water. When dry graphene ink and pure DI water were used as lubricants, the graphene coating initially peeled off, and the friction coefficient rapidly increased to a large value. However, when a lubricant with graphene ink added to DI water was used, a lubricating film was formed on the graphene coating and the friction coefficient was reduced significantly. Under dry and pure DI water conditions, severe wear morphologies were formed on the graphene coating surface, whereas in the case of the lubricant with graphene inks added to DI water, insignificant wear morphologies were formed. When the mixing ratio between DI water and graphene ink was 100:10 and 100:5, the friction coefficient and wear rate were the lowest, respectively. As a result of a long-term experiment in which the sliding cycle was performed for up to 100,000 cycles under the same experimental conditions, the lubricant with a 100:10 mixing ratio showed excellent lubrication properties, confirming that the friction coefficient and wear rate were significantly reduced compared to that of the dry or pure DI water lubrication conditions.