The transient force exerted by a low-speed liquid droplet impinging onto a flat rigid surface is investigated experimentally. The measurements employ a high-sensitivity piezo-electric sensor, along with a high-speed camera, and cover four decades in droplet Reynolds number and greater than two decades in Weber number. Across these ranges, the peak of individual force profiles span from 3 mN to over 1300 mN. Once normalised, the force–time profiles support the existence of an inertially dominated self-similar regime. Within this regime, previous numerical and theoretical studies predict a $\sqrt{t}$ dependence of impact normal force during the initial pre-peak rise. While our measurements confirm this finding, they also indicate that, after the peak force the profiles exhibit an exponential decay. This long-time decay law suggests treatment of the momentum transport from the droplet using a lumped model. An observed linear dependence between the force and force decay rate supports this approach. The reason for the efficacy of treating this system via a lumped model apparently connects to the physics right at the surface that limit the rate of momentum transport from the droplet to the surface. This is explored by estimating the momentum transfer by solely using the deforming droplet shape, but under the condition of negligible momentum gradients within the droplet. The short- and long-time solutions are combined and the resulting model equation is shown to accurately cover the entire force–time profile.
A ubiquitous experiment to characterize the formability of sheet metal is the simple tension test. Past research has shown that if the material is repeatedly bent and unbent during this test (i.e., Continuous-Bending-under-Tension, CBT), the percent elongation at failure can significantly increase. In this paper, this phenomenon is evaluated in detail for AA-6022-T4 sheets using a custom-built CBT device. In particular, the residual ductility of specimens that are subjected to CBT processing is investigated. This is achieved by subjecting a specimen to CBT processing and then creating subsize tensile test and microstructural samples from the specimens after varying numbers of CBT cycles. Interestingly, the engineering stress initially increases after CBT processing to a certain number of cycles, but then decreases with less elongation achieved for increasing numbers of CBT cycles. Additionally, a detailed microstructure and texture characterization are performed using standard scanning electron microscopy and electron backscattered diffraction imaging. The results show that the material under CBT preserves high integrity to large plastic strains due to a uniform distribution of damage formation and evolution in the material. The ability to delay ductile fracture during the CBT process to large plastic strains, results in formation of a strong fiber texture throughout the material.
30 March 2010 in Journal of Manufacturing Science and Engineering
Alternative manufacturing processes such as hot working and electrical-assisted forming (EAF), which involves passing a high density electrical current through the workpiece during deformation, have been shown to increase the potential strain induced in materials and reduce required forces for deformation. While forming at elevated temperatures is common, the EAF process provides more significant improvements in formability without the undesirable effects associated with forming at elevated temperatures. This research investigates the effect of grain size and current density on annealed pure copper during the EAF process. The flow stress reduction effect of the process was shown to decrease with increasing grain sizes. A threshold current density, required to achieve a significant reduction in the flow stresses, becomes more apparent at larger grain sizes, and the value increases with increasing grain size. The effects increase with increasing strain due to dislocations being generated during deformation. Therefore, the dislocation density, related in part by the grain size, appears to be a factor in the EAF process.