The heat dissipation systems which have liquids as heat carriers outperform conventional dissipation systems at thermoelectric generators (TEGs). However, new elements need to be introduced such as pumps, secondary heat exchangers and piping. A predictive computational model of a dissipation system involving refrigerant liquids has been implemented. The accuracy of the model is 93 % for all its outputs: the total thermal resistance, the hydraulic losses and the auxiliary power consumption. The validation of the model has been done with a prototype mainly composed by a multi-channel heat exchanger, a fan-coil, a pump and several sensors: temperature, pressure and flow meters. A study on the influence of the water and the air mass flow over the total thermal resistance has been conducted. The total resistance dependence on the air mass flow shows the importance of including the secondary heat exchanger into the thermal and hydraulic calculations. The smallest resistance does not always obtain the highest net power generation, the high demanding power of the auxiliary equipment needed to obtain this resistance influences negatively on the net power generation. Among the experimental points, the optimum scenario obtains a 40 % additional power generation with respect to the smallest resistance point.The authors are indebted to the Spanish Ministry of Economy and Competitiveness, and European Regional Development Fund for the economic support to this work, included in the DPI2011-24287 research project

The expansion and low cost of additive manufacturing technologies have led to a revolution in the development of materials used by these technologies. There are several varieties of materials that can be used in additive manufacturing by fused deposition modeling (FDM). However, some of the properties of these materials are unknown or confusing. This article addresses the need to know the thermal conductivity in different filaments that this FDM technology uses, because there are multiple applications for these additive manufacturing products in the field of thermal insulation. For the study of thermal conductivity, the DTC-25 commercial conductivity measurement bench was used, where the tests were carried out on a set of seven different materials with 100% fabrication density—from base materials such as acrylonitrile butadiene styrene (ABS) or polylactic acid (PLA), to materials with high mechanical and thermal resistance such as thermoplastic polyurethane (TPU), polyether ether ketone (PEEK), and high-performance polyetherimide thermoplastic (ULTEM), to materials with metal inclusions (aluminum 6061) that would later be subjected to thermal after-treatments. This study shows how the parts manufactured with aluminum inclusions have a higher thermal conductivity, at 0.40 ± 0.05 W/m·K, compared to other materials with high mechanical and thermal resistance, such as TPU, with a conductivity of 0.26 ± 0.05 W/m·K.