A balanced substrate-integrated waveguide (SIW) bandpass filter (BPF) is designed and fabricated based on through-quartz-via (TQV) technologies in this article. Sixth-order filtering response centered at 41.4 GHz with equal source and load termination is achieved by the transformation of the Chebyshev polynomial. By exploiting cross-coupled resonators, the 3-dB fractional bandwidth (FBW) achieves 12.1%, and the out-of-band rejection is better than 30 dB with frequencies up to 2f₀. High CM suppression can be achieved up to 2.2f₀ with the help of two slots on the bottom metal layer. Based on the theory of the proposed SIW BPF, asymmetric diplexer with different resonance orders for two channels is studied with high isolation and wide stopband. The mixed dual-mode (TE₁₀₁ and TE₃₀₁) and single-mode (TE₁₀₁) junction resonators provide a transition between the input port and two channels. Diplexer with lower and upper channels centered at 20.2 and 37.5 GHz, respectively, is fabricated and measured to verify the proposed structure, which exhibits high isolation better than 40 dB over the whole band and a wide stopband up to 3f₀ of the lower channel. Measured results are in good agreement with the simulations.

Chiplet technology has become a hotspot in the post-Moore era and widely used in portable electronic products. However, the compact and complex internal structure of Chiplet packaging may seriously degrade the drop reliability. In this work, the drop reliability of Chiplet is analyzed, modeled, simulated, quantitatively predicted and optimized. A variety of Chiplet quarter models is established, and the distribution of deformation and stress is analyzed using the finite element method, revealing that the Si interposer is a critical location. Predictions are made for more complex multi-layer stacking structures, and fitting curves are obtained to achieve rapid drop reliability prediction. The impact of Si interposer thickness on the reliability of critical location during impact is investigated, showing that a thicker Si interposer can improve reliability. Based on these findings, a structural design method is proposed to significantly enhance Chiplet reliability, reducing deformation at critical location by 98.4% and maximum stress on the Si interposer by 39.9%.

This paper proposes a substrate integrated waveguide bandpass filter (SIW BPF), exploiting the through-dielectric via (TDV)-based 3-D integrated circuit (3-D IC) technology. The SIW BPF is designed on the dielectric cavity that is etched on the traditional low-resistivity silicon (LRSi) in a 3-D IC system, acting as the insulating material between through-silicon via plugs and LRSi. This construction can reduce prominent eddy current losses in LRSi and coupling losses among TDV plugs for the millimeter-wave application. Benzocyclobutene and glass are chosen as the dielectric cavity due to the low dielectric constant and loss tangent. The detailed design procedure beginning from the normalized Chebyshev low-pass filter to the final optimized SIW BPF is presented. The filter having a 12.5% fractional bandwidth is centered at 159.67 GHz. The return losses and insertion loss across the passband are about -10 and -1.5 dB, respectively. Numerical analysis of the advanced design system and full-wave simulation results of Ansoft's HFSS show a good agreement.

This letter presents a compact, low-loss flexible filter based on a double-interdigital coupling stepped-impedance resonator (SIR) and through-polyimide via (TPV) technology. With a fractional bandwidth (FBW) of 12.5% at 2.5 GHz, the filter achieves a low insertion loss of 1.8 dB in the flat state and only 1.95 dB under bending. Its electrical performance remains highly stable under deformation, while the structure attains a 40% size reduction over the state-of-the-art designs, offering a promising solution for wearable wireless systems demanding flexibility and spectral selectivity.

By using integrated lumped elements based on through-silicon via (TSV) technology, a 3-D low-pass filter (LPF) with ultracompact size and ultrawide stopband is proposed. The 3-D magnetic coupling is enhanced between microsize spiral inductors to increase the mutual inductance and improve the high-frequency performance. A coaxial TSV with enhanced capacitance in high resistivity silicon (HRS) is utilized both as capacitor and as a vertical interconnection without any overhead in area and routing. The 3-D nature of the proposed filter yields a miniaturized size of $0.2\times0.10$ mm ² . The LPF is analyzed with equivalent circuit model and validated with the well-matched $S$ -parameters obtained by finite element method simulation and measurement. With −3-dB cutoff frequency at 2.6 GHz, the LPF exhibits an insertion loss below 1 dB, a reflection loss over 17 dB in the passband, and a suppression level over 20 dB from 5.28 up to 40 GHz in the stopband.