Xi (Forest) Zhu (Senior Member, IEEE) received his B.Eng. and Ph.D. degrees in electronic engineering from the University of Hertfordshire, Hatfield, U.K., in 2005 and 2008, respectively. He is a Senior Lecturer at the School of Electrical and Data Engineering, the University of Technology Sydney, Ultimo, NSW, Australia. His research interests include microelectronics, especially the design of radio-frequency integrated circuits for wireless communication and radar sensing applications. He joined UTS in 2016 after receiving an ARC DECRA. In 2023, he received an ARC Future Fellowship. After undertaking work as a Research Assistant at Aberystwyth University in the U.K. (2008–2009), he moved to Australia to work as a Research Fellow at Macquarie University (2011–2016). During this period, he undertook a one-year Research Fellowship at Nanyang Technological University in Singapore (2013–2014). While maintaining a strong focus on his research, he engages regularly with industry and has published more than 150 papers in international journals and conferences. In 2022 and 2023, he was named Australia’s top researcher in the field of Microelectronics and Electronic Packaging by The Australian Research Magazine.
Xi (Forest) Zhu (Senior Member, IEEE) received his B.Eng. and Ph.D. degrees in electronic engineering from the University of Hertfordshire, Hatfield, U.K., in 2005 and 2008, respectively. He is a Senior Lecturer at the School of Electrical and Data Engineering, the University of Technology Sydney, Ultimo, NSW, Australia. His research interests include microelectronics, especially the design of radio-frequency integrated circuits for wireless communication and radar sensing applications. He joined UTS in 2016 after receiving an ARC DECRA. In 2023, he received an ARC Future Fellowship. After undertaking work as a Research Assistant at Aberystwyth University in the U.K. (2008–2009), he moved to Australia to work as a Research Fellow at Macquarie University (2011–2016). During this period, he undertook a one-year Research Fellowship at Nanyang Technological University in Singapore (2013–2014). While maintaining a strong focus on his research, he engages regularly with industry and has published more than 150 papers in international journals and conferences. In 2022 and 2023, he was named Australia’s top researcher in the field of Microelectronics and Electronic Packaging by The Australian Research Magazine.