The LC resonator-based passive pressure sensor attracts much attention because it does not need a power source or lead wires between the sensing element and the readout system. This paper presents the design and manufacturing of a passive pressure sensor that contains a variable capacitor and a copper-electroplated planar inductor. The sensor is fabricated using silicon bulk micro-machining, electroplating, and anodic bonding technology. The finite element method is used to model the deflection of the silicon diaphragm and extract the capacitance change corresponding to the applied pressure. Within the measurement range from 5 to 100 kPa, the sensitivity of the sensor is 0.052 MHz/kPa, the linearity is 2.79%, and the hysteresis error is 0.2%. Compared with the sensitivity at 27 °C, the drop of output performance is 3.53% at 140 °C.

A novel structure of the resonant pressure sensor is presented in this paper, which tactfully employs intercoupling between dual pressure-sensing diaphragms and a laterally driven resonant strain gauge. After the resonant pressure sensor principle is introduced, the coupling mechanism of the diaphragms and resonator is analyzed and the frequency equation of the resonator based on the triangle geometry theory is developed for this new coupling structure. The finite element (FE) simulation results match the theoretical analysis over the full scale of the device. This pressure sensor was first fabricated by dry/wet etching and thermal silicon bonding, followed by vacuum-packaging using anodic bonding technology. The test maximum error of the fabricated sensor is 0.0310%F.S. (full scale) in the range of 30 to 190 kPa, its pressure sensitivity is negative and exceeding 8 Hz/kPa, and its Q-factor reaches 20,000 after wafer vacuum-packaging. A novel resonant pressure sensor with high accuracy is presented in this paper.