High-performance air filtration was the key to health protection from biological and ultrafine dust pollution. A self-supporting, three-dimensional (3D) nanofibrous membrane with curled pattern was electrospun for the filtration, of which the micro-fluffy structure displayed high-filtration efficiency and low-pressure drop. The flow field in the 3D filtration membrane was simulated to optimize the process parameters to increase the filtration performance. The qualification factor increased from 0.0274 Pa⁻¹ to 0.0309 Pa⁻¹ by 12.77% after the optimization of the electrospinning parameters. The best filtration efficiency and pressure drop were 93.6% and 89.0 Pa, separately. This work provides a new strategy to fabricate 3D structures through the construction of fiber morphology and promotes further improvement of air filtration performance of fibrous filters.

Electrohydrodynamic direct-writing (EDW) is a developing technology for high-resolution printing. How to decrease the line width and improve the deposition accuracy of direct-written patterns has been the key to the promotion for the further application of EDW. In this paper, an airflow-assisted spinneret for electrohydrodynamic direct-writing was designed. An assisted laminar airflow was introduced to the EDW process, which provided an additional stretching and constraining force on the jet to reduce the surrounding interferences and enhance jet stability. The flow field and the electric field around the spinneret were simulated to direct the structure design of the airflow-assisted spinneret. Then, a series of experiments were conducted, and the results verified the spinneret design and demonstrated a stable ejection of jet in the EDW process. With assisted airflow, the uniformity of printed patterns and the deposition position accuracy of a charged jet can be improved. Complex patterns with positioning errors of less than 5% have been printed and characterized, which provide an effective way to promote the integration of micro/nanosystems.

A novel structure of the resonant pressure sensor is presented in this paper, which tactfully employs intercoupling between dual pressure-sensing diaphragms and a laterally driven resonant strain gauge. After the resonant pressure sensor principle is introduced, the coupling mechanism of the diaphragms and resonator is analyzed and the frequency equation of the resonator based on the triangle geometry theory is developed for this new coupling structure. The finite element (FE) simulation results match the theoretical analysis over the full scale of the device. This pressure sensor was first fabricated by dry/wet etching and thermal silicon bonding, followed by vacuum-packaging using anodic bonding technology. The test maximum error of the fabricated sensor is 0.0310%F.S. (full scale) in the range of 30 to 190 kPa, its pressure sensitivity is negative and exceeding 8 Hz/kPa, and its Q-factor reaches 20,000 after wafer vacuum-packaging. A novel resonant pressure sensor with high accuracy is presented in this paper.