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Environmental impact assessment studies have completely and rapidly focused on the shift from economic to environmental competitiveness in semiconductor packaging industries under the trend of small size and diverse semiconductor products. This study has two main objectives, namely, (1) to adopt traditional life cycle impact assessment (LCIA) for investigating the environmental damage of three packaging technologies, namely, ball grid array (BGA), flip chip (FC), and lead frame (LF). Two commonly used materials in 2017, namely, gold and copper wires, were analyzed. The functional unit was defined on the basis of the packaging volume (1 mm3); (2) to identify influential parameters for developing two parametric LCIA equations for the BGA. Results show that the semiconductor back-end industry should gradually replace gold wires with copper wires without affecting the function of products and should promote the low impact packaging technology (LF) while satisfying the customer’s demands. Tree influential parameters (packaging volume, wire mass, and lead counts) of LCIA are identified by regression analysis, and the lead count can be considered a worthwhile alternative parameter for allocation and establishing the parametric tool when the packaging volume of the product is unavailable. The parametric tool can reduce the time cost of collecting LCI data and avoid the analysis errors and uncertainty caused by the distribution. The research can serve as a guide for the PCRs (LCA-PCR) of the semiconductor industry for suitable alternative allocation principles and functional units.
Chien-Hung Kuo; Allen H. Hu; Lance Hongwei Hung; Kuei-Tzu Yang; Chen-Hua Wu. Life cycle impact assessment of semiconductor packaging technologies with emphasis on ball grid array. Journal of Cleaner Production 2020, 276, 124301 .
AMA StyleChien-Hung Kuo, Allen H. Hu, Lance Hongwei Hung, Kuei-Tzu Yang, Chen-Hua Wu. Life cycle impact assessment of semiconductor packaging technologies with emphasis on ball grid array. Journal of Cleaner Production. 2020; 276 ():124301.
Chicago/Turabian StyleChien-Hung Kuo; Allen H. Hu; Lance Hongwei Hung; Kuei-Tzu Yang; Chen-Hua Wu. 2020. "Life cycle impact assessment of semiconductor packaging technologies with emphasis on ball grid array." Journal of Cleaner Production 276, no. : 124301.
Depleting fossil fuel sources and worsening global warming are two of the most serious world problems. Many renewable energy technologies are continuously being developed to overcome these challenges. Among these technologies, high-concentration photovoltaics (HCPV) is a promising technology that reduces the use of expensive photovoltaic materials to achieve highly efficient energy conversion. This reduction process is achieved by adopting concentrating and tracking technologies. This study intends to understand and assess the carbon footprint and energy payback time (EPBT) of HCPV modules during their entire life cycles. The social benefit of carbon reduction is also evaluated as another indicator to assess the energy alternatives. An HCPV module and a tracker from the Institute of Nuclear Energy Research (INER) were applied, and SimaPro 8.0.2 was used for the assessment. The functional unit used in this study was 1 kWh, which is produced by HCPV, and inventory data was sourced from Ecoinvent 3.0 and the Taiwan carbon footprint calculation database. The carbon footprint, EPBT, and social benefit of carbon reduction were evaluated as 107.69 g CO2eq/kWh, 2.61 years, and 0.022 USD/kWh, respectively. Direct normal irradiation (DNI), life expectancy, and the degradation rate of HCPV system were subjected to sensitivity analysis. Results show that the influence of lifetime assumption under a low DNI value is greater than those under high DNI values. Degradation rate is also another important factor when assessing the carbon footprint of HCPV under a low DNI value and a long lifetime assumption. The findings of this study can provide several insights for the development of the Taiwanese solar industry.
Allen H. Hu; Lance Hongwei Huang; Sylvia Lou; Chien-Hung Kuo; Chin-Yao Huang; Ke-Jen Chian; Hao-Ting Chien; Hwen-Fen Hong. Assessment of the Carbon Footprint, Social Benefit of Carbon Reduction, and Energy Payback Time of a High-Concentration Photovoltaic System. Sustainability 2016, 9, 27 .
AMA StyleAllen H. Hu, Lance Hongwei Huang, Sylvia Lou, Chien-Hung Kuo, Chin-Yao Huang, Ke-Jen Chian, Hao-Ting Chien, Hwen-Fen Hong. Assessment of the Carbon Footprint, Social Benefit of Carbon Reduction, and Energy Payback Time of a High-Concentration Photovoltaic System. Sustainability. 2016; 9 (1):27.
Chicago/Turabian StyleAllen H. Hu; Lance Hongwei Huang; Sylvia Lou; Chien-Hung Kuo; Chin-Yao Huang; Ke-Jen Chian; Hao-Ting Chien; Hwen-Fen Hong. 2016. "Assessment of the Carbon Footprint, Social Benefit of Carbon Reduction, and Energy Payback Time of a High-Concentration Photovoltaic System." Sustainability 9, no. 1: 27.