Chemical–mechanical polishing (CMP) is widely adopted as a key bridge between fine rotation grinding and ion beam figuring in super-smooth monocrystalline silicon mirror manufacturing. However, controlling mid- to short-spatial-period errors during CMP is a challenge owing to the complex chemical–mechanical material removal process during surface morphology formation. In this study, the nature of chemical and mechanical material removal during CMP is theoretically studied based on a three-system elastic–plastic model and wet chemical etching behavior. The effect of the applied load, material properties, abrasive size distribution, and chemical reaction rate on the polishing surface morphology is evaluated. A microscale material removal model is established to numerically predict the silicon surface morphology and to explain the surface roughness evolution and the source of nanoscale intrinsic polishing scratches. The simulated surface morphology is consistent with the experimental results obtained by using the same polishing parameters tested by employing profilometry and atomic force microscopy. The PSD curve for both simulated surface and experimental results by profilometry and atomic force microscopy follows linear relation with double-logarithmic coordinates. This model can be used to adjust the polishing parameters for surface quality optimization, which facilitates CMP manufacturing.

Integral field spectroscopy (IFS) is capable of simultaneously collecting two-dimensional high-resolution spatial image information and spectral information in a target field of view (FOV). The image slicer is the key element in IFS for segmenting the target FOV. Current micro-image slicer fabrication methods such as molecular assembling need strictly accurate control during sticking, which is time-consuming and expensive. In this study, we improved a direct-adhesive method for thin glass slicer manufacture and alignment. Thin glass is fabricated via single polishing and direct stitching to form a micro-image slicer. Based on charge coupled device (CCD) camera tests on parallel light, the manufacture accuracy for a six-channel image slicer reaches that of the molecular assembling scheme. This method can be applied to the fabrication of image slicers with different apertures.

Semi-rigid tool polishing is widely used in the high-precision manufacturing of electroless nickel surface due to its stable material removal and high efficiency in correcting mid- and high-frequency profile errors. However, predicting mid-frequency errors remains challenging due to the complexity of their underlying sources. In this study, a theoretical model for semi-rigid tool polishing was developed based on multi-scale contact theory, incorporating a bridging model, rough surface contact, and Hertzian contact mechanics. The model accounts for the effects of tool surface roughness, polishing force, and path spacing. A series of experiments on diamond-turned electroless nickel mirrors was conducted to quantitatively evaluate the model’s feasibility and accuracy. The results demonstrate that the model can effectively predict mid-frequency errors, reveal the material removal mechanisms in semi-rigid polishing, and guide the optimization of process parameters. Ultimately, a surface with mid-frequency errors of 0.59 nm Rms (measured over a 1.26 mm × 0.94 mm window) was achieved, closely matching the predicted value of 0.64 nm.