In order to improve the detection accuracy of the surface defect detection of industrial hot rolled strip steel, the advanced technology of deep learning is applied to the surface defect detection of strip steel. In this paper, we propose a framework for strip surface defect detection based on a convolutional neural network (CNN). In particular, we propose a novel multi-scale feature fusion module (ATPF) for integrating multi-scale features and adaptively assigning weights to each feature. This module can extract semantic information at different scales more fully. At the same time, based on this module, we build a deep learning network, CG-Net, that is suitable for strip surface defect detection. The test results showed that it achieved an average accuracy of 75.9 percent (mAP50) in 6.5 giga floating-point operation (GFLOPs) and 105 frames per second (FPS). The detection accuracy improved by 6.3% over the baseline YOLOv5s. Compared with YOLOv5s, the reference quantity and calculation amount were reduced by 67% and 59.5%, respectively. At the same time, we also verify that our model exhibits good generalization performance on the NEU-CLS dataset.
In 3D packaging memory devices, solder joints are critical links between the chip and the printed circuit board (PCB). Under severe working conditions, cracks inevitably occur due to thermal shock. If cracks grow in the solder joint, the chip will be disconnected with the PCB, causing its function failure. In this paper, the reliability of solder joints under thermal shock are evaluated for 3D packaging memory devices by means of the SEM and finite element analysis. As microscopically studied by the SEM, it is found out that the main failure mechanism of solder joints in such test is the thermal fatigue failure of solder joints. Finite element analysis shows that cracks are caused by the accumulation of plastic work and creep strain. The initiation and growth of cracks are mainly influenced by the inelastic strain accumulation. The trends of cracks are influenced by the difference between the coefficient of thermal expansion (CTE) of epoxy resin and that of the chip.
At present, the situation of air pollution is still serious, and research on air filtration is still crucial. For the nanofiber air filtration membrane, the diameter, porosity, tensile strength, and hydrophilicity of the nanofiber will affect the filtration performance and stability. In this paper, based on the far-field electrospinning process and the performance effect mechanism of the stacked structure fiber membrane, nanofiber membrane was prepared by selecting the environmental protection, degradable and pollution-free natural polysaccharide biopolymer pullulan, and polyvinylidene fluoride polymer with strong hydrophobicity and high impact strength. By combining two kinds of fiber membranes with different fiber diameter and porosity, a three-layer composite nanofiber membrane with better hydrophobicity, higher tensile strength, smaller fiber diameter, and better filtration performance was prepared. Performance characterization showed that this three-layer composite nanofiber membrane had excellent air permeability and filtration efficiency, and the filtration efficiency of particles above PM 2.5 reached 99.9%. This study also provides important reference values for the preparation of high-efficiency composite nanofiber filtration membrane.
In order to improve the production quality and qualification rate of chips, X-ray nondestructive imaging technology has been widely used in the detection of chip defects, which represents an important part of the quality inspection of products after packaging. However, the current traditional defect detection algorithm cannot meet the demands of high accuracy, fast speed, and real-time chip defect detection in industrial production. Therefore, this paper proposes a new multi-scale feature fusion module (ATSPPF) based on convolutional neural networks, which can more fully extract semantic information at different scales. In addition, based on this module, we design a deep learning model (ATNet) for detecting lead defects in chips. The experimental results show that at 8.2 giga floating point operations (GFLOPs) and 146 frames per second (FPS), mAP0.5 and mAP0.5–0.95 can achieve an average accuracy of 99.4% and 69.3%, respectively, while the detection speed is faster than the baseline yolov5s by nearly 50%.
The centrifugal electrostatic blowing process proposed in this paper solves the difficult continuous and stable deposition problem in the traditional centrifugal electrostatic spinning process. By establishing a flight deposition model of the centrifugal electrostatic spraying process, CFD is used to simulate and analyze the electrohydrodynamic effect of centrifugal jets, and the driving mechanism is explored. Subsequently, MATLAB is used to obtain the optimal solution conditions, and finally, the establishment of a two-dimensional flight trajectory model is completed and experimentally verified. In addition, the deposition model of the jet is established to clarify the flight trajectory under the multi-field coupling, the stable draft area of the jet is found according to this, and the optimal drafting station is clarified. This research provides new ideas and references for the exploration of the deposition mechanism of the centrifugal electrostatic blowing and electrostatic spinning process.