This paper presents a novel capacitive microelectromechanical systems (MEMS) accelerometer with slanted supporting beams and all-silicon sandwich structure. Its sensing mechanism is quite similar to an ordinary sandwich-type MEMS accelerometer, except that its proof mass is suspended by a beam parallel to the {111} plane of a (100) silicon wafer. In this way, each sensing element can detect accelerations in two orthogonal directions. Four of these sensing elements could work together and constitute a 3-axis micro-accelerometer by using a simple planar assembly process. This design avoids the traditional 3-axis accelerometer’ disadvantage of possible placement inaccuracy when assembling on three different planes and largely reduces the package volume. The slanted-beam accelerometer’s performance was modeled and analyzed by using both analytical calculations and finite element method (FEM) simulations. A prototype of one sensing element was fabricated and tested. Measured results show that this accelerometer has a good bias stability 76.8 ppm (1σ, tested immediately after power on), two directional sensitivities (sensitivity angle α = 45.4°) and low nonlinearity (<0.5%) over a sensing range up to ±50 g, which demonstrates a great opportunity for future high-precision three-axis inertial measurement.

In a MEMS capacitive accelerometer, there is an offset due to mechanical and electrical factors, and the offset would deteriorate the performance of the accelerometer. Reducing the offset from mechanism would benefit the improvement in performance. Yet, the compositions of the offset are complex and mix together, so it is difficult to decompose the offset to provide guidance for the reduction. In this work, a decomposition method of offset in a MEMS capacitive accelerometer was proposed. The compositions of the offset were first analyzed quantitatively, and methods of measuring key parameters were developed. Based on our proposed decomposition method, the experiment of offset decomposition with a closed-loop MEMS capacitive accelerometer was carried out. The results showed that the offset successfully decomposed, and the major source was from the fabricated gap mismatch in the MEMS sensor. This work provides a new way for analyzing the offset in a MEMS capacitive accelerometer, and it is helpful for purposefully taking steps to reduce the offset and improve accelerometer performance.

It is meaningful to study the surface morphology of monocrystalline material, but there are few studies on the surface roughness of quartz. So, surface roughness of Z-cut quartz etched by pure ammonium bifluoride and ammonium bifluoride mixed with isopropyl alcohol (IPA) solution was investigated for the first time in this paper. Firstly, when etching in pure ammonium bifluoride solutions, the surface roughness change with etching time, etching temperature, and solution concentration were studied. Then, the surface roughness improvement given by isopropyl alcohol solution was analyzed carefully. The experimental results indicated that: the surface roughness of Z-cut quartz (0001) plane increased with etching time, but decreased with etching temperature and solution concentration; the adding of isopropyl alcohol in ammonium bifluoride solution could decrease the roughness and improve the surface quality. This is the first systemic research of the evolution of quartz surface roughness when etching in ammonium bifluoride solution, and will benefit the future design and manufacture of quartz MEMS devices.