For the MEMS capacitive accelerometer, parasitic capacitance is a serious problem. Its mismatch will deteriorate the performance of accelerometer. Obtaining the mismatch of the parasitic capacitance precisely is helpful for improving the performance of bias and scale. Currently, the method of measuring the mismatch is limited in the direct measuring using the instrument. This traditional method has low accuracy for it would lead in extra parasitic capacitive and have other problems. This paper presents a novel method based on the mechanism of a closed-loop accelerometer. The strongly linear relationship between the output of electric force and the square of pre-load voltage is obtained through theoretical derivation and validated by experiment. Based on this relationship, the mismatch of parasitic capacitance can be obtained precisely through regulating electrostatic stiffness without other equipment. The results can be applied in the design of decreasing the mismatch and electrical adjusting for eliminating the influence of the mismatch.

For linear accelerometers, calibration with a precision centrifuge is a key technology, and the input acceleration imposed on the accelerometer should be accurately obtained in the calibration. However, there are often errors in the installation of sample that make the calibration inaccurate. To solve installation errors and obtain the input acceleration in the calibration of the accelerometer, a calibration method based on the rotation principle using a double turntable centrifuge is proposed in this work. The key operation is that the sub-turntable is rotated to make the input axis of the accelerometer perpendicular to the direction of the centripetal acceleration vector. Models of installation errors of angle and radius were built. Based on these models, the static radius and input acceleration can be obtained accurately, and the calibration of the scale factor, nonlinearity and asymmetry can be implemented. Using this method, measurements of the MEMS accelerometer with a range of ±30 g were carried out. The results show that the discrepancy of performance obtained from different installation positions was smaller than 100 ppm after calibrating the input acceleration. Moreover, the results using this method were consistent with those using the back-calculation method. These results demonstrate that the effectiveness of our proposed method was confirmed. This method can measure the static radius directly eliminating the installation errors of angle and radius, and it simplifies the accelerometer calibration procedure.

In this paper, we proposed an efficient and high-precision process for fabricating large-area microlens arrays using thermal reflow combined with ICP etching. When the temperature rises above the glass transition temperature, the polymer cylinder will reflow into a smooth hemisphere due to the surface tension effect. The dimensional differences generated after reflow can be corrected using etching selectivity in the following ICP etching process, which transfers the microstructure on the photoresist to the substrate. The volume variation before and after reflow, as well as the effect of etching selectivity using process parameters, such as RF power and gas flow, were explored. Due to the surface tension effect and the simultaneous molding of all microlens units, machining a 3.84 × 3.84 mm² silicon microlens array required only 3 min of reflow and 15 min of ICP etching with an extremely low average surface roughness Sa of 1.2 nm.

Vacuum packaging is used extensively in MEMS sensors for improving performance. However, the vacuum in the MEMS chamber gradually degenerates over time, which adversely affects the long-term performance of the MEMS sensor. A mathematical model for vacuum degradation is presented in this article for evaluating the degradation of vacuum packaged MEMS sensors, and a temperature-accelerated test of MEMS gyroscope with different vacuums is performed. A mathematical degradation model is developed to fit the parameters of the degradation of Q-factor over time at three different temperatures. The results indicate that the outgassing rate at 85 °C is the highest, which is 0.0531 cm²/s; the outgassing rate at 105 °C is the lowest, which is 0.0109 cm²/s; and the outgassing rate at 125 °C is in the middle, which is 0.0373 cm²/s. Due to the different mechanisms by which gas was released, the rate of degradation did not follow this rule. It will also be possible to predict the long-term reliability of vacuum packaged MEMS sensors at room temperature based on this model.

In a MEMS capacitive accelerometer, there is an offset due to mechanical and electrical factors, and the offset would deteriorate the performance of the accelerometer. Reducing the offset from mechanism would benefit the improvement in performance. Yet, the compositions of the offset are complex and mix together, so it is difficult to decompose the offset to provide guidance for the reduction. In this work, a decomposition method of offset in a MEMS capacitive accelerometer was proposed. The compositions of the offset were first analyzed quantitatively, and methods of measuring key parameters were developed. Based on our proposed decomposition method, the experiment of offset decomposition with a closed-loop MEMS capacitive accelerometer was carried out. The results showed that the offset successfully decomposed, and the major source was from the fabricated gap mismatch in the MEMS sensor. This work provides a new way for analyzing the offset in a MEMS capacitive accelerometer, and it is helpful for purposefully taking steps to reduce the offset and improve accelerometer performance.

During long-term use, MEMS accelerometers will experience degradation, such as bias and scale factor changes. Bias of MEMS capacitive accelerometers usually comes from the mismatch of parasitic capacitance and sensitive capacitance. This paper focuses on the mismatch of sensitive capacitance and analyzes the mechanism of long-term degradation of MEMS accelerometers. Firstly, the effect of sensitive capacitance mismatch on the performance of a MEMS accelerometer was investigated. Secondly, a method of measuring the mismatch of sensitive capacitance was proposed, and the validation experiment shows that the accuracy of this measurement can be less than $1.10\times {10}^{-5}$ of the sensitive capacitance. For the samples in this experiment, the measurement error of this method can be less than 0.36 fF. Finally, a high-temperature acceleration experiment was performed. The mismatch of the sensitive capacitance during the experiment was monitored based on the proposed method, and the experimental results are analyzed. The experimental result demonstrates that the mismatch of sensitive capacitance varies linearly with time. The change rates of sensitive capacitance mismatch for the two samples are $2.95\times {10}^{-7}{C}_0/h$ and $2.66\times {10}^{-7}{C}_0/h$ in the high-temperature acceleration experiment at 145 °C, respectively. The change in sensitive capacitance mismatch seems small, but it is not to be ignored during long-term use. The rate of change is similar for the same batch of samples. This could imply that the adverse effects due to the mismatch of sensitive capacitance changes can be reduced by compensating for this variation.