Yanwei Dai received his B.E. degree in engineering mechanics from Wuhan University of Technology, Wuhan, China, in 2011, his M.E. degree in solids mechanics from China Agricultural University and Ph.D. degree in mechanics from Tsinghua University, Beijing, China, in 2013 and 2018, respectively. Later, he joined the Institute of Electronics Packaging Technology and Reliability, Beijing University of Technology, where he is currently Associate Professor. He has authored and coauthored more than 40 journal and conference papers. His current research interests include the areas of structures and materials fracture and fatigue in IC packaging, reliability analyses, design and characterizations for power devices and advance packaging.