Pei Chen received his B.E. degree in mechanical engineering from Xiamen University, P. R. China in 2008, and his M. S. and Ph. D degrees in mechanical engineering from the University of Akron, United States, in 2010 and 2013, respectively. He joined the Institute of Electronics Packaging Technology and Reliability at Beijing University of Technology in 2014. Before that, he was a type engineer in Linglong Tyre and Rubber Company from 2013 to 2014. He has authored and co-authored more than 20 peer-reviewed technical publications. His current research interests include precision process of semiconductor materials, chip–package interaction, and low-dimensional electronic materials.