Microsupercapacitors (MSCs) with excellent flexibility and electrochemical capacitance are promising energy storage devices for wearable electronics. In this paper, we present a 3D porous poly(3,4-ethylenedioxythiophene):poly(4-styrenesulfonate) (PEDOT:PSS)/graphene composite sponge (PGCS) fabricated via a facile self-assembly process for highly stretchable, high areal capacitance MSCs. The proposed self-assembly process enables simultaneously the following in one-step: (1) separation of PSS and PEDOT from PEDOT:PSS, (2) reduction of graphene oxide (GO) into reduced graphene oxide (rGO), and (3) integration of PEDOT and rGO into a hybrid 3D composite. By tuning the mass ratio of PEDOT:PSS and GO, PGCSs with different porosities, mechanical properties, conductivities, and capacitances can be obtained. With the incorporation of PEDOT into rGO, the PGCS exhibits enhanced electrochemical performance and better mechanical flexibility. The fabricated stretchable MSC exhibits a high areal specific capacitance (19.3 mF cm⁻² at a scan rate of 20 mV s⁻¹), good electrochemical stability (88.6% retention of specific capacitance after 5000 cycles), and a remarkable stretchability (87.1% retention of specific capacitance after 50% stretching). This facile approach provides a general strategy for synergistic self-assembly of composite sponges and the design of stretchable 3D MSCs, suitable for energy storage devices with high stretchability and high energy density.

Stretchable micro-supercapacitors (MSCs) with high power density and small size have been intensively researched in the recent years. However, to date, the stretchability of the overall device is still limited by the lack of a stretchable electrode material, which results in significant performance degradation, particularly in the highly stretched state. Herein, a new method for designing natively stretchable MSCs capable of maintaining high electrochemical performance in a highly (200%) stretched state is presented. The electrode is based on the novel incorporation of the bis(trifluoromethane) sulfonamide lithium salt (LiTFSI) and poly(vinyl alcohol) (PVA) into a PEDOT:PSS hydrogel. The resultant PEDOT:PSS-LiTFSI-PVA hydrogel is operated with a PVA/H₂SO₄ electrolyte to deliver an unprecedented level of combined performance such as a large areal capacitance of 44.5 mF cm⁻², a power density of 0.04 mW cm⁻² at an area energy density of 0.004 mW h cm⁻², and an excellent stretchability of 200% while retaining 93% of the original capacitance. The MSCs deliver highly stable performance even under extensive stretching, showing a high 92% capacitance retention after 2000 cycles of 100%-strain stretching. The proposed MSC architecture is compatible with laser patterning, which enables rapid fabrication, and reflects a highly practical approach for realizing high performance, mechanically robust micro energy storage devices.

Monodispersed nanoparticles consisting of barium titanate (BaTiO3, BT) as the core and polyvinylpyrrolidone (PVP) as the shell were synthesized in a PVP-assisted low-temperature process in an aqueous solution at ambient pressure. In order to clarify the mechanism of this unique BT–PVP nanoparticle growth and the origin of the dispersion, the concentration and molecular weight of PVP used in the synthesis were varied, and the size and dispersion of the resulting nanoparticles in water were investigated by field-emission scanning electron microscopy and dynamic light scattering. Monodispersed nanoparticles with an average size of 130 nm were obtained by using an intermediate PVP concentration of 100 g/L and a PVP molecular weight of 10,000 g/mol. The thickness of the PVP shell was estimated by thermogravimetric analysis. For the highly dispersed BT–PVP, the thickness of PVP adsorbed on the BT surface was around 3–5 nm. Direct SEM observation of monodispersed BT–PVP in an aqueous solution using a unique sample holder was also demonstrated for the first time

Temporary bonding/debonding (TBDB) technologies have greatly contributed to the reliable fabrication of thin devices. However, the rapid development of large-scale, high-precision and ultra-thin devices in the semiconductor field has also proposed more stringent requirements for TBDB technologies. Here, we deliberate the recent progress of materials for temporary bonding and different debonding technologies over the past decade. Several common debonding methods are described, including thermal slide, wet chemical dissolution, mechanical peeling and laser ablation. We review the current status of different debonding technologies and highlight the applications of TBDB technologies in advanced electronic packaging. Possible solutions are proposed for the challenges and opportunities faced by different TBDB technologies. Ultimately, we attempt to propose an outlook on their future development and more possible applications. We believe that the simple schematics and refined data presented in this review would give readers a deep understanding of TBDB technologies and their vast application scenarios in future advanced electronic packaging.