At present, ultraviolet sensors are utilized in numerous fields ranging from various spectroscopy applications via biotechnical innovations to industrial process control. Despite this, the performance of current UV sensors is surprisingly poor. Here, we break the theoretical one-photon–one-electron barrier and demonstrate a device with a certified external quantum efficiency above 130% in UV range without external amplification. The record high performance is obtained using a nanostructured silicon photodiode with self-induced junction. We show that the high efficiency is based on effective utilization of multiple carrier generation by impact ionization taking place in the nanostructures. While the results can readily have a significant impact on the UV-sensor industry, the underlying technological concept can be applied to other semiconductor materials, thereby extending above unity response to longer wavelengths and offering new perspectives for improving efficiencies beyond the Shockley-Queisser limit.

Black silicon is an interesting surface texture for solar cells because of its extremely low reflectance on a wide wavelength range and acceptance angle. In this paper we present how black silicon (b-Si) texturization can be applied on the boron doped front surface of an n-type solar cell resulting in an efficiency of 18.7%. We show that the highly boron doped emitter can be formed on black silicon without losing its good optical properties and that atomic layer deposited aluminum oxide provides good surface passivation on these boron doped b-Si emitters

In semiconductor manufacturing, black silicon (bSi) has traditionally been considered as a sign of unsuccessful etching. However, after more careful consideration, many of its properties have turned out to be so superior that its integration into devices has become increasingly attractive. In devices where bSi covers the whole wafer surface, such as solar cells, the integration is already rather mature and different bSi fabrication technologies have been studied extensively. Regarding the integration into devices where bSi should cover only small selected areas, existing research focuses on device properties with one specific bSi fabrication method. Here, we fabricate bSi patterns with varying dimensions ranging from millimeters to micrometers using three common bSi fabrication techniques, i.e., plasma etching, metal-assisted chemical etching (MACE) and femtosecond-laser etching, and study the corresponding fabrication characteristics and resulting material properties. Our results show that plasma etching is the most suitable method in the case of $\mu \text{m}$ -scale devices, while MACE reaches surprisingly almost the same performance. Femtosecond-laser has potential due to its maskless nature and capability for hyperdoping, however, in this study its moderate accuracy, large silicon consumption and spreading of the etching damage outside the bSi region leave room for improvement.