In semiconductor manufacturing, black silicon (bSi) has traditionally been considered as a sign of unsuccessful etching. However, after more careful consideration, many of its properties have turned out to be so superior that its integration into devices has become increasingly attractive. In devices where bSi covers the whole wafer surface, such as solar cells, the integration is already rather mature and different bSi fabrication technologies have been studied extensively. Regarding the integration into devices where bSi should cover only small selected areas, existing research focuses on device properties with one specific bSi fabrication method. Here, we fabricate bSi patterns with varying dimensions ranging from millimeters to micrometers using three common bSi fabrication techniques, i.e., plasma etching, metal-assisted chemical etching (MACE) and femtosecond-laser etching, and study the corresponding fabrication characteristics and resulting material properties. Our results show that plasma etching is the most suitable method in the case of $\mu \text{m}$ -scale devices, while MACE reaches surprisingly almost the same performance. Femtosecond-laser has potential due to its maskless nature and capability for hyperdoping, however, in this study its moderate accuracy, large silicon consumption and spreading of the etching damage outside the bSi region leave room for improvement.

Detection of UV light has traditionally been a major challenge for Si photodiodes due to reflectance losses and junction recombination. Here we overcome these problems by combining a nanostructured surface with an optimized implanted junction and compare the obtained performance to state-of-the-art commercial counterparts. We achieve a significant improvement in responsivity, reaching near ideal values at wavelengths all the way from 200 to 1000 nm. Dark current, detectivity, and rise time are in turn shown to be on a similar level. The presented detector design allows a highly sensitive operation over a wide wavelength range without making major compromises regarding the simplicity of the fabrication or other figures of merit relevant to photodiodes.

The femtosecond‐pulsed laser processed black silicon (fs‐bSi) features high absorptance in a wide spectral range but suffers from high amount of laser induced damage as compared with bSi fabricated by other methods. Here, the aim is to minimize the charge carrier recombination in the fs‐bSi caused by laser damage as indicated by the sub‐bandgap absorption and as quantified by the carrier lifetime, while maintaining high absorption in the above bandgap. The effect of the laser parameters, including the focal position, the average power, and the scan speed are systematically studied by characterizing the surface morphology, the absorptance spectra, and the minority‐carrier recombination lifetime. For the surface passivation of fs‐bSi, the well‐established atomic layer deposited (ALD) Al₂O₃ is used. The results show that with the tailored laser parameters, high average absorptance of about 96% in the visible range and minority carrier lifetime of 54 μs at the injection level of Δn = 1 · 10¹⁵ cm⁻³ can be obtained simultaneously. This work paves the way toward high‐performance broadband optoelectronic devices based on surface passivated fs‐bSi.

Femtosecond laser-textured black silicon (fs-bSi) is known to suffer from heavy minority carrier recombination resulted from laser irradiation. In this letter, we demonstrate that the thermal annealing step, generally used to recover the crystal damage, could improve the minority carrier lifetime of the fs-bSi wafers only from $8 \mu \text{s}$ to $12 \mu \text{s}$ , even when using as high temperature as 800 °C. However, with an optimized wet chemical etching process, we obtain a high minority carrier lifetime of 2 ms without sacrificing the optical properties of the samples, i.e., the absorptance remains above 90% in the studied wavelength range (250–1100 nm). Increasing the etching time further leads to a total recovery of the lifetime up to 10.5 ms, which proves that the damage originating from the fs-laser texturing extends only to the near-surface layer (a few $\mu \text{m}$ ) of silicon.