A high-temperature sensor based on a metamaterial unit cell is proposed in this paper. The wireless passive temperature sensing method is based on the electromagnetic backscatter principle, and thus has the advantages of higher quality, lower environmental interference, and anti-low frequency interference. We developed a finite-element method-based model for the sensor via high-frequency simulation software (HFSS). A double split-ring resonator (SRR) with an outer ring length of 13 mm was designed on alumina ceramic substrate. The sensor was fabricated at 2.42 GHz using micromechanical technology and screen printing technology. When the temperature increased from 28 to 1100 °C, the resonant frequency decreased from 2.417 to 2.320 GHz with an average sensitivity of 95.63 kHz/°C. As the sensor is easily designed and fabricated, it can be used for chipless radio frequency identification (RFID) tags by simply changing the size of rings. Furthermore, emerging 3D printing technology and commercial desktop inkjet printers will be used to realize the rapid low-cost preparation of the sensor, enabling its wide range of applications in aerospace, military, manufacturing, transportation, and other fields.

This paper presents a new wireless sensor structure based on a substrate integrated circular waveguide (SICW) for the temperature test in harsh environments. The sensor substrate material is 99% alumina ceramic, and the SICW structure is composed of upper and lower metal plates and a series of metal cylindrical sidewall vias. A rectangular aperture antenna integrated on the surface of the SICW resonator is used for electromagnetic wave transmission between the sensor and the external antenna. The resonant frequency of the temperature sensor decreases when the temperature increases, because the relative permittivity of the alumina ceramic increases with temperature. The temperature sensor presented in this paper was tested four times at a range of 30–1200 °C, and a broad band coplanar waveguide (CPW)-fed antenna was used as an interrogation antenna during the test process. The resonant frequency changed from 2.371 to 2.141 GHz as the temperature varied from 30 to 1200 °C, leading to a sensitivity of 0.197 MHz/°C. The quality factor of the sensor changed from 3444.6 to 35.028 when the temperature varied from 30 to 1000 °C.

A wireless and passive temperature sensor operating up to 800 °C is proposed. The sensor is based on microwave backscatter RFID (radio frequency identification) technology. A thin-film planar structure and simple working principle make the sensor easy to operate under high temperature. In this paper, the proposed high temperature sensor was designed, fabricated, and characterized. Here the 99% alumina ceramic with a dimension of 40 mm × 40 mm × 1 mm was prepared in micromechanics for fabrication of the sensor substrate. The metallization of the Au slot patch was realized in magnetron sputtering with a slot width of 2 mm and a slot length of 32 mm. The measured resonant frequency of the sensor at 25 °C is 2.31 GHz. It was concluded that the resonant frequency decreases with the increase in the temperature in range of 25–800 °C. It was shown that the average sensor sensitivity is 101.94 kHz/°C.

In order to identify suitable substrate materials for sue in high‐temperature pressure sensors that can operate above 1000°C, the high‐temperature properties of four high‐performance ceramics (99% pure Al₂O₃ (99Al₂O₃), 97% pure Al₂O₃ (97Al₂O₃), sapphire, and ZrO₂) were investigated. Three‐point bend testing was used to measure the flexural strengths and flexural moduli of these ceramics, and transient laser emission was used to measure their thermal conductivities. The samples were prepared by hot‐press sintering: plates with the dimensions of 3.5 × 5 × 50 mm³ for the bend testing and rods of φ12.5 × 1.5 mm³ for the thermal conductivity measurements. Curves showing the dependence of flexural strength, flexural modulus, and thermal conductivity on temperature were obtained. The results show that the flexural strength and thermal conductivity of sapphire are much greater than those of the other ceramics tested. Thus, we conclude that sapphire is the most appropriate of these materials for use in high‐temperature pressure sensors for operation at up to 1000°C.

Purpose: This paper aims to present a novel wireless passive pressure sensor based on an aperture coupled microstrip patch antenna embedded with an air cavity for pressure measurement. Design/methodology/approach: In this paper, the sensitive membrane deformed when pressure was applied on the surface of the sensor and the relative permittivity of the mixed substrate changed, resulting in a change in the center frequency of the microstrip antenna. The size of the pressure sensor is determined by theoretical calculation and software simulation. Then, the sensor is fabricated separately as three layers using printed circuit board technology and glued together at last. The pressure test of the sensor is carried out in a sealed metal tank. Findings: The extracted resonant frequency was found to monotonically shift from 2.219 to 1.974 GHz when the pressure varied from 0 to 300 kPa, leading to an average absolute sensitivity of 0.817 MHz/kPa. Research limitations/implications: This pressure sensor proposed here is mainly to verify the feasibility of this wireless passive maneuvering structure, and when the base material of this structure is replaced with some high-temperature-resistant material, the sensor can be used to measure the pressure inside the aircraft engine. Originality/value: The sensor structure proposed here can be used to test the pressure in a high-temperature environment when the base material is replaced with some high-temperature-resistant material.