A heat sink is a specific type of heat exchanger integrated with heat generating devices - mostly electronics - for the sake of thermal management. In the design procedure of heat sinks, several considerations such as manufacturing cost, reliability, thermal and hydraulic performance have to be included. In the past few decades, the prevailing trend of electronics design miniaturization has led to high-power-density systems necessitating high performance cooling concepts. This paper intends to provide a comprehensive review on various employed heat transfer enhancement techniques in cooling procedures of electronics thermal management devices, with a focus on core ideas. The main motivation is to give a rapid overview on the key concepts in different high-performance cooling designs along with a quantitative comparison between the different concepts all in one reference which is missing in literature. For this, the key idea of each design is firstly categorized, and then a detailed description is provided for each case. The discussed categories consist of concepts based on channel cooling in various scales, phase transition, jet impingement, spray cooling and hybrid design. At the end, quantitative comparison is illustrated for thermal and hydraulic performance of a selection of the reviewed references covering all these different categories. Based on this comparison, an overview on thermo-hydraulic performance of the presented categories is provided, and recommendations for future studies are given based on this and the detailed review of references.

The potential of MS‐SOFCs was demonstrated through the previous EU METSOFC project, which concluded that the development of oxidation resistant novel metal‐supported solid oxide fule cell (MS‐SOFC) design and stack is the requirement to advance this technology to the next level. The following EU METSAPP project has been executed with an overall aim of developing advanced metal‐supported cells and stacks based on a robust, reliable and up‐scalable technology. During the project, oxidation resistant nanostructured anodes based on modified SrTiO₃ were developed and integrated into MS‐SOFCs to enhance their robustness. In addition, the manufacturing of metal‐supported cells with different geometries, scalability of the manufacturing process was demonstrated and more than 200 cells with an area of ∼150 cm² were produced. The electrochemical performance of different cell generations was evaluated and best performance and stability combination was observed with doped SrTiO₃ based anode designs. Furthermore, numerical models to understand the corrosion behavior of the MS‐SOFCs were developed and validated. Finally, the cost effective concept of coated metal interconnects was developed, which resulted in 90% reduction in Cr evaporation, three times lower Cr₂O₃ scale thickness and increased lifetime. The possibility of assembling these cells into two radically different stack designs was demonstrated.