A heat sink is a specific type of heat exchanger integrated with heat generating devices - mostly electronics - for the sake of thermal management. In the design procedure of heat sinks, several considerations such as manufacturing cost, reliability, thermal and hydraulic performance have to be included. In the past few decades, the prevailing trend of electronics design miniaturization has led to high-power-density systems necessitating high performance cooling concepts. This paper intends to provide a comprehensive review on various employed heat transfer enhancement techniques in cooling procedures of electronics thermal management devices, with a focus on core ideas. The main motivation is to give a rapid overview on the key concepts in different high-performance cooling designs along with a quantitative comparison between the different concepts all in one reference which is missing in literature. For this, the key idea of each design is firstly categorized, and then a detailed description is provided for each case. The discussed categories consist of concepts based on channel cooling in various scales, phase transition, jet impingement, spray cooling and hybrid design. At the end, quantitative comparison is illustrated for thermal and hydraulic performance of a selection of the reviewed references covering all these different categories. Based on this comparison, an overview on thermo-hydraulic performance of the presented categories is provided, and recommendations for future studies are given based on this and the detailed review of references.

In this work, selected numerical simulation aspects are analyzed in terms of their effect on predictions of the m-c interface. The fixed-grid enthalpy porosity phase change model, which is highly attractive in the field of modeling sapphire crystallization processes, is examined for its sensitivity to the mushy zone parameter as well as the grid resolution. A further focus is set to the simulation of thermal transport including internal radiation in the crystal and the melt via the finite volume method. Depending on the purpose of the investigation, different requirements on the angular resolutions are relevant. While most of the m-c interface as well as the temperature distribution remain practically unchanged at reasonable resolutions, a high sensitivity of the m-c interface in the near-wall region is demonstrated. This sensitivity is also observed in terms of radiative transport and, hence, the total heat transfer.