Training and recognition with neural networks generally require high throughput, high energy efficiency, and scalable circuits to enable artificial intelligence tasks to be operated at the edge, i.e., in battery-powered portable devices and other limited-energy environments. In this scenario, scalable resistive memories have been proposed as artificial synapses thanks to their scalability, reconfigurability, and high-energy efficiency, and thanks to the ability to perform analog computation by physical laws in hardware. In this work, we study the material, device, and architecture aspects of resistive switching memory (RRAM) devices for implementing a 2-layer neural network for pattern recognition. First, various RRAM processes are screened in view of the device window, analog storage, and reliability. Then, synaptic weights are stored with 5-level precision in a 4 kbit array of RRAM devices to classify the Modified National Institute of Standards and Technology (MNIST) dataset. Finally, classification performance of a 2-layer neural network is tested before and after an annealing experiment by using experimental values of conductance stored into the array, and a simulation-based analysis of inference accuracy for arrays of increasing size is presented. Our work supports material-based development of RRAM synapses for novel neural networks with high accuracy and low-power consumption.

Recent trends in deep learning (DL) have made hardware accelerators essential for various high-performance computing (HPC) applications, including image classification, computer vision, and speech recognition. This survey summarizes and classifies the most recent developments in DL accelerators, focusing on their role in meeting the performance demands of HPC applications. We explore cutting-edge approaches to DL acceleration, covering not only GPU- and TPU-based platforms but also specialized hardware such as FPGA- and ASIC-based accelerators, Neural Processing Units, open hardware RISC-V-based accelerators, and co-processors. This survey also describes accelerators leveraging emerging memory technologies and computing paradigms, including 3D-stacked Processor-In-Memory, non-volatile memories like Resistive RAM and Phase Change Memories used for in-memory computing, as well as Neuromorphic Processing Units, and Multi-Chip Module-based accelerators. Furthermore, we provide insights into emerging quantum-based accelerators and photonics. Finally, this survey categorizes the most influential architectures and technologies from recent years, offering readers a comprehensive perspective on the rapidly evolving field of deep learning acceleration.

While Resistive RAM (RRAM) are seen as an alternative to NAND Flash, their variability and cycling understanding remain a major roadblock. Extensive characterizations of multi-kbits RRAM arrays during Forming, Set, Reset and cycling operations are presented allowing the quantification of the intrinsic variability factors. As a result, the fundamental variability limits of filament-based RRAM in the full resistance range are identified.

Resistive switching memory (RRAM) is a promising technology for embedded memory and its application in computing. In particular, RRAM arrays can provide a convenient primitive for matrix-vector multiplication (MVM) with strong impact on the acceleration of neural networks for artificial intelligence (AI). At the same time, RRAM is affected by intrinsic conductance variations, which might cause degradation of accuracy in AI inference hardware. This work provides a detailed study of the multilevel-cell (MLC) programming of RRAM for neural network applications. We compare three MLC programming schemes and discuss their variations in terms of the different slopes in the programming characteristics. We test the accuracy of a two-layer fully connected neural network (FC-NN) as a function of the MLC scheme, the number of weight levels, and the weight mapping configuration. We find a tradeoff between the FC-NN accuracy, size, and current consumption. This work highlights the importance of a holistic approach to AI accelerators encompassing the device properties, the overall circuit performance, and the AI application specifications.

Resistive random access memories (RRAMs) feature high-speed operations, low-power consumption, and nonvolatile retention, thus serving as a promising candidate for future memory applications. To explore the applications of the RRAM, switching variability and cycling endurance need to be addressed. This paper presents extensive characterizations of multi-kb RRAM arrays during forming, set, reset, and cycling operations. The relationships among programming conditions, memory window, and endurance features are presented. The experimental results are then used to perform variability-aware simulations of a 128-bit RRAM-based ternary content-addressable-memory (TCAM) macro. The tradeoff among endurance, search latency, and reliability in terms of match/mismatch detection is explored, identifying the programming conditions that allow to obtain a searching speed comparable to static random access memory-based TCAMs (2 ns on average and 3 ns at 3σ) while guaranteeing good reliability metrics (with a time ratio of 3000 on average and 150 at 3σ).