Advanced dispensing technology is urgently needed to improve the jetting performance of fluid to meet the requirements of electronic product integration and miniaturization. In this work, an on–off valve piezostack-driven dispenser was used as a study object to investigate the effect of needle structure on jetting performance. Based on fluid dynamics, we investigated nozzle cavity pressure and jet velocity during the dispensing process using theoretical simulation for needles with and without a side cap. The results showed that the needle with a side cap had larger jet velocity and was capable of generating 8.27 MPa of pressure in the nozzle cavity, which was 2.39 times larger than the needle without a side cap. Further research on the influence of the nozzle and needle structural parameters showed that a nozzle conic angle of 85°–105°, needle conic angle of 10°–35°, and side clearance of 0.1–0.3 mm produced a dispenser with a large jet velocity and stable performance, capable of dispensing microscale droplets. Finally, a smaller droplet diameter of 0.42 mm was achieved in experiments using a glycerol/ethanol mixture, with a variation range of ± 4.61%.

Thin-film sensors are regarded as advanced technologies for in situ condition monitoring of components operating in harsh environments, such as aerospace engines. Nevertheless, these sensors encounter challenges due to the high-temperature oxidation of materials and intricate manufacturing processes. This paper presents a simple method to fabricate high temperature-resistant oxidized SiCN precursor and La(Ca)CrO₃ composite thin film temperature sensors by screen printing and air annealing. The developed sensor demonstrates a broad temperature response ranging from 200 °C to 1100 °C with negative temperature coefficients (NTC). It exhibits exceptional resistance to high-temperature oxidation and maintains performance stability. Notably, the sensor’s resistance changes by 3% after exposure to an 1100 °C air environment for 1 h. This oxidation resistance improvement surpasses the currently reported SiCN precursor thin-film sensors. Additionally, the sensor’s temperature coefficient of resistance (TCR) can reach up to −7900 ppm/°C at 200 °C. This strategy is expected to be used for other high-temperature thin-film sensors such as strain gauges, heat flux sensors, and thermocouples. There is great potential for applications in high-temperature field monitoring.

Polymer-derived ceramic (PDC) thin-film sensors have a very high potential for extreme environments. However, the erosion caused by high-temperature airflow at the hot-end poses a significant challenge to the stability of PDC thin-film sensors. Here, we fabricate a thin-film coating by PDC/TiB₂/B composite ceramic material, which can be used to enhance the oxidation resistance and ablation resistance of the sensors. Due to the formation of a dense oxide layer on the surface of the thin-film coating in a high-temperature air environment, it effectively prevents the ingress of oxygen as a pivotal barrier. The coating exhibits an exceptionally thin oxide layer thickness of merely 8 μm, while its oxidation resistance was rigorously assessed under air exposure at 800 °C, proving its enduring protection for a minimum duration of 10 h. Additionally, during ablation testing using a flame gun that can generate temperatures of up to 1000 °C, the linear ablation rate of thin-film coating is merely 1.04 μm/min. Our analysis reveals that the volatilization of B₂O₃ occurs while new SiO₂ is formed on the thin-film coating surface. This phenomenon leads to the absorption of heat, thereby enhancing the ablative resistance performance of the thin-film sensor. The results indicate that the thin-film sensor exhibits exceptional resistance to oxidation and ablation when protected by the coating, which has great potential for aerospace applications.

The effective transmission of signals from high-temperature sensors in harsh environments is crucial in aerospace applications. However, the rapid fabrication of thin/thick film conductive lines (TFCLs) while avoiding damage to the substrate and minimizing disturbance remains challenging. Here, we present a strategy for the direct conformal printing of silver-palladium (AgPd) TFCLs, enabling the stable lead-out of signals from high-temperature sensors across corners without drilling the substrate, solving the problem of traditional perforated leads damaging the substrate structure. The fabricated AgPd TFCL exhibits excellent electrical performance with a low temperature coefficient of resistance of 197 ppm/°C (from 200 to 800 °C) and high long-term stability, as evidenced by a resistance drift rate of 0.71%/h (during 24 h of isothermal aging at 800 °C). Furthermore, the TFCL demonstrates outstanding scouring resistance, high bond strength, and exceptional process compatibility. As a proof of concept, a high-temperature probe was prepared, and cross-corner TFCLs enabled the nondestructive extraction of signals from a resistance temperature detector, spanning from the front to the back of the substrate. This technology establishes a foundation for signal lead-outs from sensors on specially shaped curved surfaces in extreme environments.

A control chip with a multistage flow-rate regulation function based on the correlation between the flow resistance and flow rate has been developed in this article. Compared with the traditional proportional solenoid valve, this kind of flow valve based on microfluidic technology has the characteristics of being light-weight and having no electric drive. It solves such technical problems as how the current digital microfluidic chip can only adjust the flow switch, and the adjustment of the flow rate is difficult. To linearize the output signal, we propose a design method of weighted resistance. The output flow is controlled by a 4-bit binary pressure signal. According to the binary value of the 4-bit pressure signal at the input, the output can achieve 16-stage flow adjustment. Furthermore, we integrate the three-dimensional flow resistance network, multilayer structure microvalve, and parallel fluid network into a single chip by using 3D printing to obtain a modular flow control unit. This structure enables the microflow control signal to be converted from a digital signal to an analogue signal (DA conversion), and is suitable for microflow driving components, such as in microfluidic chip sampling systems and proportional mixing systems. In the future, we expect this device to even be used in the automatic control system of a miniature pneumatic soft actuator.