A reliable protective layer is one of the main challenges in preventing oxidation of thin film sensors to achieve accurate, effective, and stable readings at high temperatures. In this work, an Al₂O₃-modified polymer-derived ceramic SiCN composite coating fabricated by a direct-writing technique is utilized as a protective layer for thin film sensors. The microstructure evolution of the Al₂O₃/SiCN films is examined herein. The protective layer exhibits excellent oxidation resistance and thermal stability at high temperatures up to 1000 °C, which contributes to improving the stability and lifetime of thin film sensors in extreme environments. The TiB₂/SiCN thin film resistive grid with the Al₂O₃/SiCN composite film as a protective layer is fabricated and tested. The results indicate that the coating can protect the TiB₂/SiCN thin film resistive grid at high temperatures up to 1000 °C, which is about 200 °C higher than that of the TiB₂/SiCN thin film resistive grid without a protective layer. The resistance change rates of the TiB₂/SiCN thin film resistive grid with a protective layer are 0.5%/h at 900 °C and 10.7%/h at 1000 °C.

Thin-film sensors are regarded as advanced technologies for in situ condition monitoring of components operating in harsh environments, such as aerospace engines. Nevertheless, these sensors encounter challenges due to the high-temperature oxidation of materials and intricate manufacturing processes. This paper presents a simple method to fabricate high temperature-resistant oxidized SiCN precursor and La(Ca)CrO₃ composite thin film temperature sensors by screen printing and air annealing. The developed sensor demonstrates a broad temperature response ranging from 200 °C to 1100 °C with negative temperature coefficients (NTC). It exhibits exceptional resistance to high-temperature oxidation and maintains performance stability. Notably, the sensor’s resistance changes by 3% after exposure to an 1100 °C air environment for 1 h. This oxidation resistance improvement surpasses the currently reported SiCN precursor thin-film sensors. Additionally, the sensor’s temperature coefficient of resistance (TCR) can reach up to −7900 ppm/°C at 200 °C. This strategy is expected to be used for other high-temperature thin-film sensors such as strain gauges, heat flux sensors, and thermocouples. There is great potential for applications in high-temperature field monitoring.

Polymer-derived ceramic (PDC) thin-film sensors have a very high potential for extreme environments. However, the erosion caused by high-temperature airflow at the hot-end poses a significant challenge to the stability of PDC thin-film sensors. Here, we fabricate a thin-film coating by PDC/TiB₂/B composite ceramic material, which can be used to enhance the oxidation resistance and ablation resistance of the sensors. Due to the formation of a dense oxide layer on the surface of the thin-film coating in a high-temperature air environment, it effectively prevents the ingress of oxygen as a pivotal barrier. The coating exhibits an exceptionally thin oxide layer thickness of merely 8 μm, while its oxidation resistance was rigorously assessed under air exposure at 800 °C, proving its enduring protection for a minimum duration of 10 h. Additionally, during ablation testing using a flame gun that can generate temperatures of up to 1000 °C, the linear ablation rate of thin-film coating is merely 1.04 μm/min. Our analysis reveals that the volatilization of B₂O₃ occurs while new SiO₂ is formed on the thin-film coating surface. This phenomenon leads to the absorption of heat, thereby enhancing the ablative resistance performance of the thin-film sensor. The results indicate that the thin-film sensor exhibits exceptional resistance to oxidation and ablation when protected by the coating, which has great potential for aerospace applications.

Current methods for thin film sensors preparation include screen printing, inkjet printing, and MEMS (microelectromechanical systems) techniques. However, their limitations in achieving sub-10 μm line widths hinder high-density sensors array fabrication. Electrohydrodynamic (EHD) printing is a promising alternative due to its ability to print multiple materials and multilayer structures with patterned films less than 10 μm width. In this paper, we innovatively proposed a method using only EHD printing to prepare ultra-micro thin film temperature sensors array. The sensitive layer of the four sensors was compactly integrated within an area measuring 450 μm × 450 μm, featuring a line width of less than 10 μm, and a film thickness ranging from 150 nm to 230 nm. The conductive network of silver nanoparticles exhibited a porosity of 0.86%. After a 17 h temperature-resistance test, significant differences in the performance of the four sensors were observed. Sensor 3 showcased relatively superior performance, boasting a fitted linearity of 0.99994 and a TCR of 937.8 ppm/°C within the temperature range of 20 °C to 120 °C. Moreover, after the 17 h test, a resistance change rate of 0.17% was recorded at 20 °C.

Conformal thin film sensing represents a cutting-edge technology capable of precisely measuring complex surface temperature fields under extreme conditions. However, fabricating high-temperature-resistant conformal thin film thermocouple arrays remains challenging. This study reports a method for manufacturing conformal thin film thermocouple arrays on metal spherical surfaces using a printable paste composed of silicates and Ag. Specifically, the use of silicate glass phases enhances the high-temperature performance of the silver printable paste, enabling the silver ink coatings to withstand temperatures up to 947 °C and survive over 25 h at 900 °C. The thermocouples, connected to Pt thin films, exhibited a Seebeck coefficient of approximately 17 μV/°C. As a proof of concept, an array of six Ag/Pt thin film thermocouples was successfully fabricated on a metal spherical surface. Compared to traditional wire-type thermocouples, the conformal thin film thermocouple arrays more accurately reflect temperature variations at different points on a spherical surface. The Ag/Pt conformal thin film thermocouple arrays hold promise for monitoring temperature fields in harsh environments, such as aerospace and nuclear energy applications.

Direct ink writing (DIW) of high-temperature thin-film sensors holds significant potential for monitoring extreme environments. However, existing high-temperature inks face a trade-off between cost and performance. This study proposes a SiCN/RuO₂/TiB₂ composite ceramic ink. The added TiB₂, after annealing in a high-temperature atmospheric environment, forms B₂O₃ glass, which synergizes with the SiO₂ glass phase formed from the SiCN precursor to effectively encapsulate RuO₂ particles. This enhances the film’s density and adhesion to the substrate, preventing RuO₂ volatilization at high temperatures. Additionally, the high conductivity of TiB₂ improves the film’s overall conductivity. Test results indicate that the SiCN/RuO₂/TiB₂ film exhibits high linearity from room temperature to 900 °C, high stability (resistance drift rate of 0.1%/h at 800 °C), and high conductivity (4410 S/m). As a proof of concept, temperature sensors and a heat flux sensor were successfully fabricated on a metallic hemispherical surface. Performance tests in extreme environments using high-power lasers and flame guns verified that the conformal thin-film sensor can accurately measure spherical temperature and heat flux, with a heat flux sensor response time of 53 ms. In conclusion, the SiCN/RuO₂/TiB₂ composite ceramic ink developed in this study offers a high-performance and cost-effective solution for high-temperature conformal thin-film sensors in extreme environments.