This study investigated the influence of reinforcing 0.50 wt.% of titanium oxide (TiO₂) and aluminium oxide (Al₂O₃) nanoparticles on the wettability performance of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy. The thermal properties of the SAC305 nanocomposite solder are comparable with thos of an SAC305 solder with a peak temperature window within a range of 240 to 250 °C. The wetting behaviour of the non-reinforced and reinforced SAC305 nanocomposite solder was determined and measured using the contact angle and spreading area and the relationships between them were studied. There is an increment in the spreading area (5.6 to 7.32 mm) by 30.71% and a reduction in the contact angle (26.3 to 18.6°) by 14.29% with an increasing reflow time up to 60 s when reinforcing SAC305 solder with 0.50 wt.% of TiO₂ and Al₂O₃ nanoparticles. The SAC305 nanocomposite solder has a better wetting performance compared with the SAC305 solder. As the reflow time increased, the spreading area increased and the contact angle decreased, which restricted intermetallic compound growth and thus improved wettability performance

In this study, titanium dioxide (TiO₂) was deposited onto a fluorine-doped tin oxide (FTO) substrate using the sol–gel spin coating method. Through the implementation of calcination treatment on the thin film, enhancements were observed in terms of structural, optical, and morphological properties. Various calcination temperatures were explored, with TiO₂ annealed at 600 °C identified as the optimal sample. Analysis of the X-ray diffraction spectroscopy (XRD) pattern revealed the prominent orientation plane of (101), indicating the presence of anatase TiO₂ with a tetragonal pattern at this temperature. Despite fluctuations in the optical spectrum, the highest transmittance of 80% was observed in the visible region within the wavelength range of 400 nm. The estimated band-gap value of 3.45 eV reaffirmed the characteristic of TiO₂. Surface analysis indicated the homogeneous growth of TiO₂, uniformly covering the FTO substrate. Cross-sectional examination revealed a thickness of 263 nm with dense and compact nature of TiO₂ thin film. No presence of defects or pores reflects a well-organized structure and high-quality formation. Significant electrical rectification properties were observed, indicating the successful formation of a p–n junction. In summary, calcination treatment was found to be crucial for enhancing the properties of the thin film, highlighting its significance in the development of solar cell applications.

This study investigated the influence of adding 0.50 wt% and 1.0 wt% titanium dioxide (TiO₂) and aluminium oxide (Al₂O₃) nanoparticles on the properties of Sn3.0Ag0.5Cu (SAC305) lead-free solder alloy. In terms of thermal properties, SAC305 lead-free solder with or without addition of TiO₂ and Al₂O₃ nanoparticles, the melting temperature is very similar and comparable. The wetting performance of the SAC305 nanocomposite solder was determined by the contact angle. The best contact angle recorded is 31.65° at reflow temperature of 250°C for 0.50 wt% addition of TiO₂ and Al₂O₃ nanoparticles. The thickness of the IMC layer was observed using an Optical Microscope and measured. Results show that the thickness of the IMC layer decreased when TiO₂ and Al₂O₃ nanoparticles were reinforced into the SAC305 solder system, which shows significant decrease when 0.50wt% of TiO₂ and Al₂O₃ nanoparticles were added. However, beyond 0.50 wt% the thickness of IMC layer increases along with increasing reflow temperature. The results reveal that the adsorption effect of TiO₂ and Al₂O₃ nanoparticles will restrict the growth of the IMC layer under controlled concentration of the nanoparticles and reflow temperature. The optimal parameters to enhance the performance of SAC305 solder by reinforcing TiO₂ and Al₂O₃ nanoparticles are reflowed at 250°C at 0.50 wt% concentration of TiO₂ and Al₂O₃ nanoparticles.