This study introduces an innovative photolithography-based method for patterning ionic and inorganic particle materials such as silver iodide (AgI). Conventional methods lack precision when patterning powdered materials, which limits their applicability. The proposed method stacks layers of a particle material (AgI) and negative-tone photoresist for simultaneous ultraviolet exposure and development, resulting in well-defined AgI patterns. The sintering process successfully removed binders from the material layer and photoresist, yielding standalone AgI patterns on the Si substrate with good adhesion. The pitch remained consistent with the design values of the photomask when the pattern size was changed. In-situ observation of condensation frosting on the patterns was conducted, which confirmed the practicality of the developed patterning process. This versatile method is applicable to large areas with a high throughput and presents new opportunities for modifying functional surfaces.