The article aims to explore boiling heat transfer in mini-channels with a rectangular cross-section using various fluids (HFE-649, HFE-7000, HFE-7100, and HFE-7200). Temperature measurements were conducted using infrared thermography for the heated wall and K-type thermocouples for the working fluid. The 2D mathematical model for heat transfer in the test section was proposed. Local heat transfer coefficients between the heated wall and the working fluid were determined from the Robin condition. The problem was solved by means of the finite element method (FEM) with Trefftz functions. The values of the heat transfer coefficient that were obtained were compared with the results calculated from Newton’s law of cooling. The average relative differences between the obtained results did not exceed 4%. The study included uncertainty analyses for temperature measurements with K- and T-type thermocouples. Expanded uncertainties were calculated using the uncertainty propagation and Monte Carlo methods. Precisely determining the uncertainties in contact temperature measurements is crucial to ensure accurate temperature data for subsequent heat transfer calculations. The results of the heat transfer investigations were compared in terms of fluid temperature, heat transfer coefficients, and boiling curves. HFE-7200 consistently exhibited the highest fluid temperature and temperature differences at boiling incipience, while HFE-7000 demonstrated the highest heat transfer coefficients. HFE-649 showed the lowest heat transfer coefficients. The boiling curves exhibited a typical shape, with a notable occurrence of ‘nucleation hysteresis phenomena’. Upon the analysis of two-phase flow patterns, bubbly and bubbly-slug structures were observed.

This study investigated FC-72 boiling heat transfer in minichannels using two non-contact temperature measurement techniques: liquid crystal thermography (LCT) and infrared thermography (IRT). These methods were applied simultaneously to measure temperature distributions on the heated wall surface of minichannels, formed by a thin metal foil. The temperature data facilitated the calculation of local heat transfer coefficients at the foil–working fluid contact surface. Calibration of the liquid crystal colour response to temperature was conducted prior to the use of LCT. According to a comparison of the heat transfer coefficients and Nusselt numbers determined using LCT and IRT measurements, comparable temperature distributions are provided, with the average relative differences in heat transfer coefficients determined using these techniques remaining below 15%. The findings highlight the advantages of non-contact temperature measurement in minimising system disturbances while providing precise data for understanding flow boiling heat transfer mechanisms. Such results can contribute to the design of minichannel heat exchangers.

This article addresses the design of a compact heat exchanger for the cooling of electronic systems. The Quality Function Deployment (QFD) method is used to identify crucial product features to improve device performance and key customer requirements. The QFD simplifies management processes, allowing modifications to device components, such as design parameters (dimensions and materials) and operating conditions (flow type and preferred temperature range). The study was applied to analyse the fundamental features of a compact heat exchanger, assessing their impact on enhancing heat transfer intensity during fluid flow through mini-channels. The thermal efficiency of the compact heat exchanger was tested experimentally. The results allow to verify the results obtained from the numerical simulations due to Simcenter STAR-CCM+. Consequently, the experimental part was reduced in favour of numerical simulations conducted using this commercial CFD software version 2020.2.1 Build 15.04.01. The numerical simulations performed with the aid of CFD showed increases in the heat transfer coefficient of up to 180% compared to the case treated as a reference. The application of the QFD matrix significantly reduces the time required to develop suitable design and material solutions and determine the operating parameters for the cooling of miniature electronic devices.

This article proposes a passive cooling system for photovoltaic (PV) panels to achieve a reduction in their temperature. It is known that the cooling of PV panels allows for an increase in the efficiency of photovoltaic conversion. Furthermore, reducing the high temperature of the surfaces of PV panels is also desirable to ensure their long-lasting operation and high efficiency. Photovoltaic panels were modified by adding copper sheets to the bottom side of the panels. Two types of modification of the outer surface of the sheet were investigated experimentally, which differed in surface roughness. One was characterised by the nominal roughness of the copper sheet according to its manufacturer, while the other was enhanced by a system of pins. Numerical simulations, performed using the Simcenter STAR-CCM+ software, version 2020.2.1 Build 15.04.010, helped to describe the geometry of the pins and their role in the resulting reduction in the temperature of the PV panel surface. As a result, modifying a typical PV panel by adding a copper sheet with pins helps to achieve a higher decrease in the temperature of the PV panel. The addition of a copper sheet with a smooth surface to the bare PV panel improved the operating conditions by lowering its surface temperature by approximately 6.5 K but using an enhanced surface with the highest number of pins distributed uniformly on the copper sheet surface resulted in the highest temperature drop up to 12 K. The highest number of pins distributed uniformly on the copper sheet surface resulted in the highest temperature drop in its bottom surface, that is, on average by more than 12 K compared to the surface temperature of the bare PV panel surface. The validation of the numerical calculations was performed on data from the experiments. An analysis of the quality of the numerical mesh was also performed using a method based on the grid convergence index.

This work presents experimental and numerical studies of heat transfer during cooling fluid flow in a group of five minichannels 1 mm deep. The main purpose was to determine the heat transfer coefficient on the contact surface between the fluid and the heated wall of the selected minichannel at subcooled boiling. The temperature distribution on the outer surface of the heated plate was measured by means of an infrared camera. Thermal and flow parameters were monitored by an appropriate data-acquisition system. The test section was placed horizontally with fluid flowing above the heated wall. The HFE-649, HFE-7100 and HFE-7200 working fluids were examined in the experiments. Simcenter STAR-CCM+ software was used for numerical analysis of heat transfer in the test section. Furthermore, a simplified two-dimensional (2D) model was proposed that designates subcooled boiling heat transfer during fluid flow in a central minichannel. The heat-transfer process in the heated plate and the working fluid was described using indicated partial differential equations with appropriate boundary conditions. The solution to the proposed system of equations led to the solving of two more inverse Cauchy-type problems. The classical Trefftz method (TM) and the homotopy perturbation method (HPM) combined with the TM allowed for obtaining temperature distributions in the heater and the fluid and consequently, the heat transfer coefficient at the heater–fluid interface from the Robin boundary condition. Comparison of the results from numerical simulation due to Simcenter STAR-CCM+ showed similar temperature distributions at the heated surface. The calculated heat transfer coefficients, by HPM and Simcenter STAR-CCM+, were validated using the 1D approach. Furthermore, the results from simulations in Simcenter STAR-CCM+ in the form of local temperatures of the heater were confronted with experimental data for comparison. Similar results were achieved.

Binary mixtures of HFE-73DE and ethyl acetate are investigated as dielectric working fluids for laminar minichannel cooling. Thermophysical properties of the pure components and four mixtures (10/90, 25/75, 50/50 and 75/25 mass % HFE-73DE/ethyl acetate) were measured over the relevant temperature range. Single-phase convective heat transfer tests were then carried out in a heated 1 × 4 × 180 mm minichannel test section under constant heat-flux conditions for pure HFE-73DE. A three-dimensional conjugate CFD model with temperature-dependent liquid properties was developed in Simcenter STAR-CCM+ and validated against these measurements; the average relative temperature difference between CFD and experiment remained below 0.5%, while a grid-convergence study based on the Grid Convergence Index (GCI) confirmed that the numerical uncertainty is comparable to the experimental one. The validated model was subsequently used to predict the axial evolution of wall temperature, fluid-core temperature, velocity and heat transfer coefficient for the four mixtures under identical conditions. The mean Nusselt numbers obtained from CFD were further compared with the classical Shah and London fully developed laminar solution for rectangular ducts, revealing that the present configuration yields values about 35–42% higher than the theoretical prediction owing to asymmetric heating and conjugate heat transfer. The results show that increasing the HFE-73DE mass fraction strengthens convective heat transfer and reduces fluid-temperature rise, while intermediate compositions (50/50 and 75/25) provide a favourable compromise between enhanced heat transfer performance and moderate pressure drop. The study provides guidance for composition selection and the design of dielectric minichannel heat exchangers operating with HFE-73DE/ethyl acetate mixtures.