Printed electronics employ established printing methods to create low-cost, mechanically flexible devices including batteries, supercapacitors, sensors, antennas and RFID tags on plastic, paper and textile substrates. This review focuses on the specific contribution of screen printing to that landscape, examining how ink viscosity, mesh selection and squeegee dynamics govern film uniformity, pattern resolution and ultimately device performance. Recent progress in advanced ink systems is surveyed, highlighting carbon allotropes (graphene, carbon nano-onions, carbon nanotubes, graphite), silver and copper nanostructures, MXene and functional oxides that collectively enhance mechanical robustness, electrical conductivity and radio-frequency behavior. Parallel improvements in substrate engineering such as polyimide, PET, TPU, cellulose and elastomers demonstrate the technique’s capacity to accommodate complex geometries for wearable, medical and industrial applications while supporting environmentally responsible material choices such as water-borne binders and bio-based solvents. By mapping two decades of developments across energy-storage layers and functional electronics, the article identifies the key process elements, recurring challenges and emerging sustainable practices that will guide future optimization of screen-printing materials and protocols for high-performance, customizable and eco-friendly flexible devices.

In this study, Silicon Carbide (SiC) nanoparticle-based serigraphic printing inks were formulated to fabricate highly sensitive and wide temperature range printed thermistors. Inter-digitated electrodes (IDEs) were screen printed onto Kapton^® substrate using commercially avaiable silver ink. Thermistor inks with different weight ratios of SiC nanoparticles were printed atop the IDE structures to form fully printed thermistors. The thermistors were tested over a wide temperature range form 25 °C to 170 °C, exhibiting excellent repeatability and stability over 15 h of continuous operation. Optimal device performance was achieved with 30 wt.% SiC-polyimide ink. We report highly sensitive devices with a TCR of −0.556%/°C, a thermal coefficient of 502 K ($\beta$-index) and an activation energy of $0.08$ eV. Further, the thermistor demonstrates an accuracy of ±1.35 °C, which is well within the range offered by commercially available high sensitivity thermistors. SiC thermistors exhibit a small 6.5% drift due to changes in relative humidity between 10 and 90%RH and a 4.2% drift in baseline resistance after 100 cycles of aggressive bend testing at a 40° angle. The use of commercially available low-cost materials, simplicity of design and fabrication techniques coupled with the chemical inertness of the Kapton^® substrate and SiC nanoparticles paves the way to use all-printed SiC thermistors towards a wide range of applications where temperature monitoring is vital for optimal system performance.

This review article provides a comprehensive analysis of the photonic sintering conditions necessary to process non-oxide ceramics, to obtain similar material properties when compared with those of thermally annealed ones, for various applications in printed electronics. This article presents a thorough examination of the scientific literature on this topic, discussing the principles of photonic sintering applied to non-oxide ceramics, its advantages over traditional post-processing methods, and a quantitative overview of the performance of devices fabricated with the crystalline materials obtained.

Printed electronics utilize traditional printing techniques to develop low-cost, flexible electronic devices such as batteries, supercapacitors or sensors. This review concentrates on the role of screen printing in the production of energy storage devices, emphasizing its adaptability to meet the requirements for customizable electronic devices for daily, medical, and industrial applications. Key aspects of the screen printing process, including ink viscosity, mesh selection, and squeegee dynamics, are discussed in detail due to their significant influence on the quality and functionality of the final products. The review explores the use of advanced materials, such as graphene, carbon nano-onions, carbon nanotubes and graphite, which enhance the mechanical and electrical properties of batteries. Advances in substrates are also examined, highlighting their ability to accommodate diverse device geometries and enhance the versatility of applications, as well as, the sustainability of materials and methods used in screen printing, advocating for environmentally friendly practices. Overall, this paper provides a comprehensive overview of screen printing in the context of printed battery production, underscoring its potential to fulfill future requirements for high-performance, flexible, and eco-friendly electronic devices. The findings aim to guide potential research and optimize screen printing techniques and materials to enhance device performance in various applications.

Inkjet printing enables contactless deposition onto fragile substrates for printed energy-storage devices and supports flexible batteries and supercapacitors with reduced material use. This review examines multilayer and interdigital architectures and analyzes how ink rheology, droplet formation, colloidal interactions, and the printability window govern performance. For batteries, reported inkjet-printed electrodes commonly deliver capacities of ~110–150 mAh g⁻¹ for oxide cathodes at C/2–1 C, with coulombic efficiency ≥98% and stability over 10²–10³ cycles; silicon anodes reach ~1.0–2.0 Ah g⁻¹ with efficiency approaching 99% under stepwise formation. Typical current densities are ~0.5–5 mA cm⁻² depending on areal loading, and multilayer designs with optimized drying and parameter tuning can yield rate and discharge behavior comparable to cast films. For supercapacitors, inkjet-printed microdevices report volumetric capacitances in the mid-hundreds of F cm⁻³, translating to ~9–34 mWh cm⁻³ and ~0.25–0.41 W cm⁻³, with 80–95% retention after 10,000 cycles and coulombic efficiency near 99%. In solid-state configurations, stability is enhanced, although often accompanied by reduced areal capacitance. Although solids loading is lower than in screen printing, precise material placement together with thermal or photonic sintering enables competitive capacity, rate capability, and cycle life while minimizing waste. The review consolidates practical guidance on ink formulation, printability, and defect control and outlines opportunities in greener chemistries, oxidation-resistant metallic systems, and scalable high-throughput printing.

We extensively studied serigraphic screen-printed commercial silver flake inks loaded with silicon inclusions in order to achieve pinning at the grain boundaries. Based on grain size measurements using electron backscattered diffraction (EBSD), commercial silver ink with silicon microparticle content of 5 wt.% shows significant grain growth retardation compared to pristine silver ink, which stabilizes electrical conductivity up to 700 °C via a Zener pinning mechanism. The modified silicon-loaded silver ink experiences a two-times increase in grain size when heated up to 700 °C, compared to a seven-times increase for pristine silver ink. In turn, this enables operation temperatures significantly higher than the conventional operational window of microparticle-based silver inks, which are usually limited to 400 °C. Using isothermal exposures of 10 min up to 4 h, this phenomenon is observed at temperatures ranging from 250 °C to 900 °C. The electrical conductivity stability, grain size evolution and oxide contents were studied up to 4 h. The activation energy of silver ink with silicon inclusions is 54% lower than for pristine silver ink due to the pining effect, which retards grain growth via the Zener mechanism. Most importantly, the electrical resistivity remains stable up to 700 °C, which is more than twice the operation limit for off-the-shelf screen-printable silver flake inks. Hence, we demonstrate that adding controlled amounts of silicon particles to silver inks for grain structure engineering can open new vistas of possibilities for screen-printed metallic inks.