The development of electronic devices has a tendency to become more complicated in structure, more integrated in function, and smaller in size. The heat flow density of components continues to escalate, which urgently requires the development of heat sink materials with high thermal conductivity and a low coefficient of expansion. Diamond/aluminum composites have become the research hotspot of thermal management materials with excellent thermophysical and mechanical properties, taking into account the advantages of light weight. In this paper, diamond/Al composites are prepared by combining aluminum as matrix and diamond reinforcement through the discharge plasma sintering (SPS) method. The micro-interfacial bonding state of diamond and aluminum is changed by adjusting the particle size of diamond, and the macroscopic morphology performance of the composites is regulated. Through this, the flexible design of diamond/Al performance can be achieved. As a result, when 150 μm diamond powder and A1-12Si powder were used for the composite, the thermal conductivity of the obtained specimens was up to 660.1 W/mK, and the coefficient of thermal expansion was 5.63 × 10⁻⁶/K, which was a good match for the semiconductor material. At the same time, the bending strength is 304.6 MPa, which can satisfy the performance requirements of heat-sinking materials in the field of electronic packaging.

Diamond/aluminum composites have attracted significant attention as novel thermal management materials, with their interfacial bonding state and configuration playing a crucial role in determining their thermal conductivity and mechanical properties. The present work aims to evaluate the bending strength and thermal conductivity of CNT-modified Ti-coated diamond/aluminum composites with multi-scale structures. The Fe catalyst was encapsulated on the surface of Ti-coated diamond particles using the solution impregnation method, and CNTs were grown in situ on the surface of Ti-coated diamond particles using the plasma-enhanced chemical vapor deposition (PECVD) method. We investigated the influence of interface structure on the thermal conductivity and mechanical properties of diamond/aluminum composites. The results show that the CNT-modified Ti-coated diamond/aluminum composite exhibits excellent bending strength, reaching up to 281 MPa, compared to uncoated diamond/aluminum composites and Ti-coated diamond/aluminum composites. The selective bonding between diamond and aluminum was improved by the interfacial reaction between Ti and diamond particles, as well as between CNT and Al. This led to the enhanced mechanical properties of Ti-coated diamond/aluminum composites while maintaining acceptable thermal conductivity. This work provides insights into the interface’s configuration design and the performance optimization of diamond/metal composites for thermal management.