Uriel Jaramillo

Uriel Jaramillo

orcid

Research Focus & Metrics

Academic Career Length

3Years (2024-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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28 April 2024 in Electronics
Verified
Journal Article
Open access
PDF file
EGEmma Cristina Mascorro Guardado
Emma Cristina Mascorro Guardado
Susana Ortega-CisnerosSusana Ortega-Cisneros
Susana Ortega-Cisneros
ELEmilio Isaac Isaac Baungarten Leon
Emilio Isaac Isaac Baungarten Leon
LLLuis Adolfo Luna
Luis Adolfo Luna
UJUriel Jaramillo
Uriel Jaramillo
EMEmanuel Murillo-García
Emanuel Murillo-García
This article explores the evolution of integrated circuits (ICs), highlighting the fundamental role of open source Electronic Design Automation (EDA) tools in their development. It describes the IC’s design flow, differentiating between Front-end and Back-end design stages, and details the process of implementing the digital stage in offset quadrature phase-shift keying (OQPSK) modulation in an IC, including its hardware description language (HDL), the implementation test in the field-programmable gate array (FPGA), and the physical layout using the first manufactured open source process design kits (PDKs) in Global Foundries’ 180 nm, as well as the use of OpenLane and Caravel. To conclude, the results of the physical tests obtained from the digital modulation are presented, as well as the performance of the raised cosine shaping filter.

29 May 2026 in IEEE Access
Verified
Journal Article
Open access
UJUriel Jaramillo
Uriel Jaramillo
Susana Ortega-CisnerosSusana Ortega-Cisneros
Susana Ortega-Cisneros
HZHéctor Emmanuel Muñoz Zapata
Héctor Emmanuel Muñoz Zapata
ILIraam Antonio López-Salas
Iraam Antonio López-Salas
The increasing availability of open-source electronic design automation (EDA) tools and publicly accessible process design kits (PDKs) has expanded access to integrated circuit (IC) development; however, scalable system-level integration frameworks capable of supporting heterogeneous digital, analog, and mixed-signal systems remain limited. This paper presents Silicluster Version 2 (Silicluster v2), a hierarchical and scalable multi-project system-on-chip (SoC) architecture implemented in 130 nm complementary metal-oxide-semiconductor (CMOS) technology using a fully open-source register-transfer-level (RTL) to Graphic Data System II (GDSII) layout design flow. The proposed architecture enables the structured integration of up to 256 independent digital, analog, and mixed-signal modules within a single chip while preserving modular isolation, reusability, and routing efficiency. In contrast to its previous digital-focused implementation, Silicluster v2 incorporates infrastructure supporting transistor-level analog layout, parasitic-aware mixed-domain co-simulation using Simulation Program with Integrated Circuit Emphasis (SPICE), and integration of synthesized standard-cell netlists alongside custom transistor-level blocks. A hierarchical multiplexed interconnection scheme and centralized clock-distribution strategy mitigate fanout, congestion, and timing-closure challenges inherent to high-density modular integration. The complete system is validated through design rule checking (DRC), layout-versus-schematic (LVS) verification, parasitic extraction, and static timing analysis (STA) at 10 MHz, targeting 1.8V digital operation and 3.3V analog operation. The results demonstrate the feasibility of constructing complex heterogeneous integrated circuits using exclusively open-source methodologies, establishing Silicluster v2 as a validated reference architecture for collaborative silicon integration and scalable multi-project chip development.