Ceramic matrix composites have the advantages of low density, high specific strength, high specific die, high-temperature resistance, wear resistance, chemical corrosion resistance, etc., which are widely used in aerospace, energy, transportation, and other fields. CMCs have become an important choice for engine components and other high-temperature component manufacturing. However, ceramic matrix composite is a kind of multi-phase structure, anisotropy, high hardness material, due to the brittleness of the ceramic matrix, the weak bonding force between fiber and matrix, and the anisotropy of composite material. Burr, delamination, tearing, chips, and other surface damage tend to generate in the machining, resulting in surface quality and strength decline. This paper reviewed the latest abrasive machining technology for SiC ceramic composites. The characteristics and research directions of the main abrasive machining technology, including grinding, laser-assisted grinding, ultrasonic-assisted grinding, and abrasive waterjet machining, are introduced first. Then, the commonly used numerical simulation research for modeling and simulating the machining of ceramic matrix composites is briefly summarized. Finally, the processing difficulties and research hotspots of ceramic matrix composites are summarized.

The 1-3 piezoelectric composite is the key component of the acoustic transducer, which is widely used in detection, due to the high energy conversion efficiency, cheap raw material, and low aging. To reveal the influence of epoxy mixture, used to connect the piezoelectric column, on the composite performance, a 1-3 piezoelectric composite model was built. The effects of mixture properties on the impedance curves, vibration mode, and deformation displacement of the composite were determined. Six 1-3 piezoelectric composites with different filling mixture properties, by changing the glass microspheres’ mass ratio in the epoxy, were prepared and measured to validate the model. The results showed that with the increase in the proportion of the glass microsphere in the epoxy mixture, the vibration coupling of the piezoelectric composites was gradually eliminated. The acoustic impedance was reduced by 12%. The electromechanical coupling coefficient and effective electromechanical coupling coefficient were increased by 5.4% and 8.3%, respectively. The density and Young’s modulus decrease in filling mixture can significantly improve piezoelectric composite performance.

The solder burrs on the 304V wire surface can easily scratch the vascular tissue during interventional treatment, resulting in complications such as medial tears, bleeding, dissection, and rupture. Abrasive blasting is often used to remove solder burr and obtain a smooth surface for the interventional device. This study conducted an abrasive blasting experiment to explore the effects of process parameters (air pressure, lift-off height, abrasive volume, and abrasive type) on processing time, surface roughness, and mechanical properties to reveal the material removal mechanism. The results indicated that the resin abrasive can remove the SAC burr and keep the 304V integrity due to the proper hardness and Young’s module. Impaction pits are the main material removal mode in abrasive blasting. The processing time decreases with the increase in air pressure. The surface roughness increases with the increase in abrasive volume. The primary and secondary factors affecting the surface roughness of the 304V wire after abrasive blasting are the abrasive type and air pressure, followed by the abrasive volume and lift-off height. Blasting leads to a decrease in yield strength, and Young’s modulus and the hardness of the abrasive will affect the tensile strength. This study lays a foundation for understanding abrasive blasting and different cutting mechanisms.