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<mml:math display="inline"><mml:mrow><mml:msup><mml:mi>Cl</mml:mi><mml:mo>−</mml:mo></mml:msup></mml:mrow></mml:math>Cl− ions are added to the deposition bath, several features are clearly visible in the spectra, showing that SPS is adsorbed on the copper surface in a wide potential window during Cu electroplating.