The thickness of the LPCVD-Si₃N₄ gate dielectric layer significantly influences the electron transport properties of AlGaN/GaN metal–insulator–semiconductor high-electron-mobility transistors (MIS-HEMTs), but the mechanism by which it affects polarization Coulomb field (PCF) scattering remains largely unexplored. In this study, AlGaN/GaN MIS-HEMTs with LPCVD-Si₃N₄ gate dielectric thicknesses of 0 nm, 5 nm, and 20 nm were fabricated, and the influence of LPCVD-Si₃N₄ thickness on PCF scattering was systematically investigated. Through electrical measurements and theoretical calculations, the relationship between LPCVD-Si₃N₄ gate dielectric layer thickness, additional polarization charge (∆ρ), two-dimensional electron gas (2DEG) density, and 2DEG mobility was analyzed. The results show that increasing the LPCVD-Si₃N₄ thickness reduces the vertical electric field in the AlGaN barrier, weakening the inverse piezoelectric effect (IPE) and reducing ∆ρ. Further analysis reveals that the ∆ρ exhibits a non-monotonic dependence on negative gate voltage, initially increasing and subsequently decreasing, due to the competition between strain accumulation and stress relaxation. Meanwhile, the 2DEG mobility limited by PCF (μ_PCF) decreases monotonically with increasing negative gate voltage, mainly due to the progressive weakening of the 2DEG screening effect. The research results reveal the physical mechanism by which LPCVD-Si₃N₄ thickness regulates PCF scattering, providing theoretical guidance for optimizing gate dielectric parameters and enhancing the performance of AlGaN/GaN MIS-HEMTs.

A physics-based model for the output current–voltage (I–V) characteristics of AlGaN/GaN HFETs is developed based on AlGaAs/GaAs HFETs. It is demonstrated that Polarization Coulomb Field (PCF) scattering greatly influences channel electron mobility. With different gate biases, channel electron mobility is varied by PCF scattering. Furthermore, a more negative gate bias and a lower ratio of ${\mathrm{l}}_g/l_{sd}$ (gate length/source-drain space) of the device causes the PCF scattering to have stronger influence on channel electron mobility. This work is the first to apply PCF scattering to a physics-based model for AlGaN/GaN HFETs with I–V characteristics and the results indicate that PCF scattering is essential for a physics-based model to identify I–V characteristics of AlGaN/GaN HFETs.

The small-signal S parameters of the fabricated double-finger gate AlGaN/GaN high electron mobility transistors (HEMTs) were measured at various direct current quiescent operating points (DCQOPs). Under active bias conditions, small-signal equivalent circuit (SSEC) parameters such as R_s and R_d, and intrinsic parameters were extracted. Utilizing f_T and the SSEC parameters, the effective electron velocity (${\nu }_{e-eff}$) and intrinsic electron velocity (${\nu }_{e-\mathrm{int}}$) corresponding to each gate bias (V_GS) were obtained. Under active bias conditions, the influence mechanism of V_GS on ${\nu }_{e-eff}$ was systematically studied, and an expression was established that correlates ${\nu }_{e-eff}$, ${\nu }_{e-\mathrm{int}}$, and bias-dependent parasitic resistances. Through the analysis of the main scattering mechanisms in AlGaN/GaN HEMTs, it has been discovered that the impact of V_GS on ${\nu }_{e-eff}$ should be comprehensively analyzed from the aspects of ${\nu }_{e-\mathrm{int}}$ and parasitic resistances. On the one hand, changes in V_GS influence the intensity of polar optical phonon (POP) scattering and polarization Coulomb field (PCF) scattering, which lead to changes in ${\nu }_{e-\mathrm{int}}$ dependent on V_GS. The trend of ${\nu }_{e-\mathrm{int}}$ with changes in V_GS plays a dominant role in determining the trend of ${\nu }_{e-eff}$ with changes in V_GS. On the other hand, both POP scattering and PCF scattering affect ${\nu }_{e-eff}$ through their impact on parasitic resistance. Since there is a difference in the additional scattering potential corresponding to the additional polarization charges (APC) between the gate-source/drain regions and the region under the gate, the mutual effects of PCF scattering on the under-gate electron system and the gate-source/drain electron system should be considered when adjusting the PCF scattering intensity through device structure optimization to improve linearity. This study contributes to a new understanding of the electron transport mechanisms in AlGaN/GaN HEMTs and provides a novel theoretical basis for improving device performance.