Nanoscale laser damage precursors generated from fabrication have emerged as a new bottleneck that limits the laser damage resistance improvement of fused silica optics. In this paper, ion beam etching (IBE) technology is performed to investigate the evolutions of some nanoscale damage precursors (such as contamination and chemical structural defects) in different ion beam etched depths. Surface material structure analyses and laser damage resistance measurements are conducted. The results reveal that IBE has an evident cleaning effect on surfaces. Impurity contamination beneath the polishing redeposition layer can be mitigated through IBE. Chemical structural defects can be significantly reduced, and surface densification is weakened after IBE without damaging the precision of the fused silica surface. The photothermal absorption on the fused silica surface can be decreased by 41.2%, and the laser-induced damage threshold can be raised by 15.2% after IBE at 250 nm. This work serves as an important reference for characterizing nanoscale damage precursors and using IBE technology to increase the laser damage resistance of fused silica optics.

In order to achieve accurate prediction of subsurface damage (SSD) in ultra-precision grinding of high-performance ultra-violet laser-irradiated fused silica optics, the paper combines damage precursor multimodal measurement technology with magnetorheological finishing spot method detection. Various methods such as photothermal weak absorption and fluorescence confocal imaging are used for measuring the surface roughness and subsurface damage depth of a series of fused silica samples prepared under different ultra-precision grinding parameters. The correlation between surface roughness and subsurface damage depth in ultra-precision grinding based on laser damage performance is established using curve fitting. The results indicate that there is a metamorphic layer below the subsurface crack layer, which can cause additional photothermal absorption. Subsurface damage is constituted of the subsurface crack layer and metamorphic layer. Under ultra-precision grinding conditions, the maximum depth of subsurface damage is generally 2.00–4.22 times the depth of the subsurface damage cluster. The roughness Ra and the subsurface damage cluster depth correspond to SSD_(cluster) = 195 × Ra − 0.13. The maximum depth of subsurface damage can be predicted by measuring the Ra value, by which accurate prediction of defect depth in ultra-precision grinding and guiding the high-performance manufacturing of ultra-violet laser-irradiated fused silica optics can be achieved.