Martin Hirman

Dr. Martin Hirman

University of West Bohemia, Faculty of Electrical Engineering, Department of Materials and Technology
orcid

Research Focus & Metrics

Academic Career Length

7Years (2020-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

View All Publications
29 May 2022 in Textile Research Journal
Verified
Journal Article
Closed access
Martin HirmanMartin Hirman
Martin Hirman
JNJiri Navratil
Jiri Navratil
FSFrantisek Steiner
Frantisek Steiner
JRJan Reboun
Jan Reboun
RSRadek Soukup
Radek Soukup
AHAles Hamacek
Ales Hamacek
This article addresses the research and development of a reliable interconnection technique for mounting surface mounted device components onto newly developed conductive stretchable textile ribbons. The alternative nonconductive adhesive bonding in which electrical contact is realized only by mechanical pressure and fixed by an adhesive and the conventional soldering technique were selected for examination. Assessment of the performance of these techniques and their usability for interconnecting components on conductive textile ribbons was also our research goal. Reliability tests of the electrical and mechanical properties of realized interconnections (dry heat, damp heat, washing, electrical current load, jerk, and stretch tests) were realized. The results show that the nonconductive adhesive technique results in good mechanical properties and acceptable median electrical resistance of less than 2 Ω even after 90 washing cycles. It is also very gentle and fully compatible with textile production due to the maximal processing temperature lower than 70°C, without the risk of short circuit occurrence. This technique is suitable for sensors, illumination or data transfer applications. While soldering results in excellent median electrical resistance of less than 20 mΩ, it is more complex and costly. Moreover, there is a risk of short circuits as well as of textile damage by the high thermal load over 150°C. Soldering is more suitable for power supply applications or heating. The above-mentioned results were also confirmed in a decision analysis with pairwise comparisons, involving company representatives considering introducing the above-mentioned interconnection techniques into their production. The nonconductive adhesive technique was evaluated as 15% better in overall decision analysis than the low-temperature soldering.

11 January 2022 in Energies
Verified
Journal Article
Open access
PDF file
Martin HirmanMartin Hirman
Martin Hirman
JNJiri Navratil
Jiri Navratil
Michaela RadouchovaMichaela Radouchova
Michaela Radouchova
JŠJiří Štulík
Jiří Štulík
RSRadek Soukup
Radek Soukup
This article addresses reliability under the sweat of interconnection techniques for the mounting surface mounted device (SMD) components and fully printed humidity sensors onto conductive stretchable textile ribbons. Samples underwent testing for the effect of ageing by artificial sweat on their electrical resistance using both alkaline and acidic artificial sweat. The best results in terms of electrical resistance change were obtained for samples soldered to the conductive fibers interwoven in the ribbon. However, this method can damage the ribbon due to the high temperature during soldering and significantly reduce the mechanical properties and flexibility of the ribbon, which can lead to a limited service life of samples. On the other hand, adhesive bonding is a very interesting alternative, where the above-mentioned properties are preserved, but there is a significant effect of sweat ageing on electrical resistance. The results of fully printed graphene-based humidity sensors show that, for the intended use of these sensors (i.e., detection of changes in moisture on the human body), usage of the samples is possible, and the samples are sufficiently reliable in the case of sweat degradation. In addition, the response of the sensor to humidity is quite high: 98% at a relative humidity of 98%.

26 February 2024 in Power Electronic Devices and Components
Verified
Journal Article
Open access
Martin HirmanMartin Hirman
Martin Hirman
DMDavid Michal
David Michal
JRJan Reboun
Jan Reboun
FSFrantisek Steiner
Frantisek Steiner

1 May 2020
Verified
Conference Paper
Closed access
Martin HirmanMartin Hirman
Martin Hirman
JNJiri Navratil
Jiri Navratil
FSFrantišek Steiner
František Steiner
AHAles Hamacek
Ales Hamacek
The paper deals with temperature ageing reliability of joints glued by non-conductive adhesive (NCA) onto the conductive ribbon. The samples prepared with NCA were accelerated aged at 85 °C temperature for 1000 hours. The samples were also stretched on 150 % of their relaxed length during the ageing. The main aim of the experiment was to verify the possibility of NCA using to make a conductive connection of components onto the ribbon. The joints electrical resistance was measured before, during and after ageing. The results show that using this technology for standard use of ribbons is suitable and reliable.

4 February 2023
Verified
Book Chapter
Closed access
PDF file
Martin HirmanMartin Hirman
Martin Hirman
ABAndrea Benešová
Andrea Benešová
JNJiří Navrátil
Jiří Navrátil
FSFrantišek Steiner
František Steiner
JTJiri Tupa
Jiri Tupa

3 September 2024
Verified
Conference Paper
Closed access
ABAndrea Benešová
Andrea Benešová
Martin HirmanMartin Hirman
Martin Hirman
FSFrantišek Steiner
František Steiner
JTJiri Tupa
Jiri Tupa
This paper deals with the issue of digital predictive maintenance and its application to selected equipment, focusing on a case study of climate chambers. The study analyzed the current state of maintenance of these devices, performed cost calculations, and evaluated the possible risks. Based on these analyses, a procedure for the implementation of predictive maintenance was proposed, which could lead to the reduction of the identified risks and the optimization of the costs associated with the maintenance of the equipment. The paper provides a comprehensive overview of digital predictive maintenance that includes a theoretical framework, a case study, and an implementation methodology, thus contributing to a deeper understanding of the benefits and challenges associated with this area.