Cedric Rolin

Dr. Cedric Rolin

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Research Focus & Metrics

Academic Career Length

17Years (2010-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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6 November 2015 in Advanced Materials
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Journal Article
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TUTakafumi Uemura
Takafumi Uemura
CRCedric Rolin
Cedric Rolin
TKTung‐Huei Ke
Tung‐Huei Ke
PFPavlo Fesenko
Pavlo Fesenko
Jan GenoeJan Genoe
Jan Genoe
JTJun Takeya
Jun Takeya

19 July 2019 in Advanced Functional Materials
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Journal Article
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AFAzhar Fakharuddin
Azhar Fakharuddin
WQWeiming Qiu
Weiming Qiu
GCGuillaume Croes
Guillaume Croes
ADAndrius Devižis
Andrius Devižis
RGRokas Gegevičius
Rokas Gegevičius
PHPaul Heremans
Paul Heremans

5 July 2016 in Advanced Materials
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Journal Article
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RJRobby Janneck
Robby Janneck
FVFederico Vercesi
Federico Vercesi
PHPaul Heremans
Paul Heremans
Jan GenoeJan Genoe
Jan Genoe
CRCedric Rolin
Cedric Rolin

10 October 2017 in Advanced Materials
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Journal Article
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RJRobby Janneck
Robby Janneck
NPNicolas Pilet
Nicolas Pilet
SBSatya Prakash Bommanaboyena
Satya Prakash Bommanaboyena
BWBenjamin Watts
Benjamin Watts
PHPaul Heremans
Paul Heremans
CRCedric Rolin
Cedric Rolin

1 November 2024 in Journal of Applied Physics
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Journal Article
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JSJean-Philippe Soulié
Jean-Philippe Soulié
KSKiroubanand Sankaran
Kiroubanand Sankaran
BTBenoit Van Troeye
Benoit Van Troeye
ALAlicja Leśniewska
Alicja Leśniewska
OPOlalla Varela Pedreira
Olalla Varela Pedreira
CAChristoph Adelmann
Christoph Adelmann
Interconnect resistance and reliability have emerged as critical factors limiting the performance of advanced CMOS circuits. With the slowdown of transistor scaling, interconnect scaling has become the primary driver of continued circuit miniaturization. The associated scaling challenges for interconnects are expected to further intensify in future CMOS technology nodes. As interconnect dimensions approach the 10 nm scale, the limitations of conventional Cu dual-damascene metallization are becoming increasingly difficult to overcome, spurring over a decade of focused research into alternative metallization schemes. The selection of alternative metals is a highly complex process, requiring consideration of multiple criteria, including resistivity at reduced dimensions, reliability, thermal performance, process technology readiness, and sustainability. This Tutorial introduces the fundamental criteria for benchmarking and selecting alternative metals and reviews the current state of the art in this field. It covers materials nearing adoption in high-volume manufacturing, materials currently under active research, and potential future directions for fundamental study. While early alternatives to Cu metallization have recently been introduced in commercial CMOS devices, the search for the optimal interconnect metal remains ongoing.

11 April 2017 in Nature Communications
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CRCedric Rolin
Cedric Rolin
EKEnpu Kang
Enpu Kang
Jeong-Hwan LeeJeong-Hwan Lee
Jeong-Hwan Lee
GBGustaaf Borghs
Gustaaf Borghs
PHPaul Heremans
Paul Heremans
Jan GenoeJan Genoe
Jan Genoe
Thin film transistors based on high-mobility organic semiconductors are prone to contact problems that complicate the interpretation of their electrical characteristics and the extraction of important material parameters such as the charge carrier mobility. Here we report on the gated van der Pauw method for the simple and accurate determination of the electrical characteristics of thin semiconducting films, independently from contact effects. We test our method on thin films of seven high-mobility organic semiconductors of both polarities: device fabrication is fully compatible with common transistor process flows and device measurements deliver consistent and precise values for the charge carrier mobility and threshold voltage in the high-charge carrier density regime that is representative of transistor operation. The gated van der Pauw method is broadly applicable to thin films of semiconductors and enables a simple and clean parameter extraction independent from contact effects.