Flexible sensors have the potential to be seamlessly applied to soft and irregularly shaped surfaces such as the human skin or textile fabrics. This benefits conformability dependant applications including smart tattoos, artificial skins and soft robotics. Consequently, materials and structures for innovative flexible sensors, as well as their integration into systems, continue to be in the spotlight of research. This review outlines the current state of flexible sensor technologies and the impact of material developments on this field. Special attention is given to strain, temperature, chemical, light and electropotential sensors, as well as their respective applications.

In the last years, the development of new materials as well as advanced fabrication techniques have enabled the transformation of electronics from bulky rigid structures into unobtrusive soft systems. This gave rise to new thin-film devices realized on previously incompatible and unconventional substrates, such as temperature-sensitive polymers, rough organic materials or fabrics. Consequently, it is now possible to realize thin-film structures on active substrates which provide additional functionality. Examples include stiffness gradients to match mechanical properties, mechanical actuation to realize smart grippers and soft robots, or microfluidic channels for lab-on-chip applications. Composite or microstructured substrates can be designed to have bespoke electrical, mechanical, biological and chemical features making the substrate an active part of a system. Here, the latest developments of smart structures carrying thin-film electronics are reviewed. Whereby the focus lies on soft and flexible systems, designed to fulfill tasks, not achievable by electronics or the substrate alone. After a brief introduction and definition of the requirements and topic areas, the materials for substrates and thin-film devices are covered with an emphasis on their intrinsic properties. Next, the technologies for electronics and substrates fabrication are summarized. Then, the desired properties and design strategies of various active substrate are discussed and benchmarked against the current state-of-the-art. Finally, available demonstrations, and use cases are presented. The review concludes by mapping the available technologies to innovative applications, identifying promising underdeveloped fields of research and potential future progress.

Textiles enhanced with thin-film flexible sensors are well-suited for unobtrusive monitoring of skin parameters due to the sensors’ high conformability. These sensors can be damaged if they are attached to the surface of the textile, also affecting the textiles’ aesthetics and feel. We investigate the effect of embedding flexible temperature sensors within textile yarns, which adds a layer of protection to the sensor. Industrial yarn manufacturing techniques including knit braiding, braiding, and double covering were utilised to identify an appropriate incorporation technique. The thermal time constants recorded by all three sensing yarns was <10 s. Simultaneously, effective sensitivity only decreased by a maximum of 14% compared to the uncovered sensor. This is due to the sensor being positioned within the yarn instead of being in direct contact with the measured surface. These sensor yarns were not affected by bending and produced repeatable measurements. The double covering method was observed to have the least impact on the sensors’ performance due to the yarn’s smaller dimensions. Finally, a sensing yarn was incorporated in an armband and used to measure changes in skin temperature. The demonstrated textile integration techniques for flexible sensors using industrial yarn manufacturing processes enable large-scale smart textile fabrication.

Textiles provide an ideal structure for embedding sensors for medical devices. Skin temperature measurement is one area in which a sensor textile could be particularly beneficial; pathological skin is normally very sensitive, making the comfort of anything placed on that skin paramount. Skin temperature is an important parameter to measure for a number of medical applications, including for the early detection of diabetic foot ulcer formation. To this end an electronic temperature-sensor yarn was developed by embedding a commercially available thermistor chip into the fibres of a yarn, which can be used to produce a textile or a garment. As part of this process a resin was used to encapsulate the thermistor. This protects the thermistor from mechanical and chemical stresses, and also allows the sensing yarn to be washed. Building off preliminary work, the behaviour and performance of an encapsulated thermistor has been characterised to determine the effect of encapsulation on the step response time and absolute temperature measurements. Over the temperature range of interest only a minimal effect was observed, with step response times varying between 0.01–0.35 s. A general solution is presented for the heat transfer coefficient compared to size of the micro-pod formed by the encapsulation of the thermistor. Finally, a prototype temperature-sensing sock was produced using a network of sensing yarns as a demonstrator of a system that could warn of impending ulcer formation in diabetic patients.

Embedding temperature sensors within textiles provides an easy method for measuring skin temperature. Skin temperature measurements are an important parameter for a variety of health monitoring applications, where changes in temperature can indicate changes in health. This work uses a temperature sensing yarn, which was fully characterized in previous work, to create a series of temperature sensing garments: armbands, a glove, and a sock. The purpose of this work was to develop the design rules for creating temperature sensing garments and to understand the limitations of these devices. Detailed design considerations for all three devices are provided. Experiments were conducted to examine the effects of contact pressure on skin contact temperature measurements using textile-based temperature sensors. The temperature sensing sock was used for a short user trial where the foot skin temperature of five healthy volunteers was monitored under different conditions to identify the limitations of recording textile-based foot skin temperature measurements. The fit of the sock significantly affected the measurements. In some cases, wearing a shoe or walking also heavily influenced the temperature measurements. These variations show that textile-based foot skin temperature measurements may be problematic for applications where small temperature differences need to be measured.

In medicine, temperature changes can indicate important underlying pathologies such as wound infection. While thermographs for the detection of wound infection exist, a textile substrate offers a preferable solution to the designs that exist in the literature, as a textile is very comfortable to wear. This work presents a fully textile, wearable, thermograph created using temperature-sensing yarns. As described in earlier work, temperature-sensing yarns are constructed by encapsulating an off-the-shelf thermistor into a polymer resin micro-pod and then embedding this within the fibres of a yarn. This process creates a temperature-sensing yarn that is conformal, drapeable, mechanically resilient, and washable. This work first explored a refined yarn design and characterised its accuracy to take absolute temperature measurements. The influence of contact errors with the refined yarns was explored seeing a 0.24 ± 0.03 measurement error when the yarn was held just 0.5 mm away from the surface being measured. Subsequently, yarns were used to create a thermograph. This work characterises the operation of the thermograph under a variety of simulated conditions to better understand the functionality of this type of textile temperature sensor. Ambient temperature, insulating material, humidity, moisture, bending, compression and stretch were all explored. This work is an expansion of an article published in The 4th International Conference on Sensor and Applications.