In our research on sustainable solutions for printed electronics, we are moving towards renewable materials in applications, which can be very challenging from the performance perspective, such as printed circuit boards (PCB). In this article, we examine the potential suitability of wood-based materials, such as cardboard and veneer, as substrate materials for biodegradable solutions instead of the commonly used glass-fiber reinforced epoxy. Our substrate materials were coated with fire retardant materials for improved fire resistance and screen printed with conductive silver ink. The print quality, electrical conductivity, fire performance and biodegradation were evaluated. It was concluded that if the PCB application allows manufacturing using screen printing instead of an etching process, there is the potential for these materials to act as substrates in, e.g., environmental analytics applications.

The purpose of this work was to select an efficient drying technique for drying of highly porous thick fiber foam mats with minimum impact on their structure after forming and drainage. Thick fiber mats were produced from wood fibers using foam-forming technology and dried using several different drying methods. The mixture of pine fibers and surfactant (foaming agent) in water was blended using a high-speed blender. After fiber foam generation, a sample mold was filled with wet fiber foam, and after drainage, drying experiments were performed. For comparison, experiments were carried out in an oven, an impingement dryer assisted with a vacuum, and a combined impingement-infrared dryer. At low moisture contents, through-air drying experiments were also carried out. Drying curves, temperature profiles, and shrinkage were measured from the produced mat structures. The most promising drying technique in this study was the combined impingement-infrared drying, used until the fiber mat became permeable, followed by through-air drying until the desired final moisture content was achieved.