The objective of this paper is to advance the state of the art in the characterization of the multipactor effect in dielectric materials. The materials studied are the most commonly used dielectrics in space applications, namely, Alumina, Rexolite, Rogers RT5870, Rohacell, Teflon, and Ultem 1000. In this paper, a new family of coaxial waveguide components, covering the $L$- and $S$-bands, with a wideband, low-pass response has been designed, and six different prototypes have been specifically optimized and manufactured. The six prototypes have then been used to simulate and measure the multipactor breakdown susceptibility charts for the six dielectric materials investigated. Finally, the simulation results are compared with the results of the measurement campaign indicating good agreement.

Substrate-integrated circuits (SICs) [1] have attracted much attention in the last several years because of their great potential. The first implementation of the concept can be found in [2] as a feeding mechanism for a slot array antenna. Deslandes and Wu [3], [4] used the term substrate-integrated waveguide (SIW) to define this waveguide integrated in a substrate where the lateral walls are synthesized with metallized via holes, and the upper and lower walls are the top and bottom metallization of the substrate.

This article describes the design procedure of a compact wideband waveguide filter, based on stepped impedance resonators (SIRs) and a combined usage of capacitive and inductive coupling irises, that provides a significant improvement in the out-of-band response of the filter with respect to the state-of-the-art. In addition to theory, several filter prototypes have been designed and manufactured. A detailed sensitivity analysis has also been carried out. Finally, simulations and measurements are compared, showing very good agreement, thereby fully validating the new filter topology.

The empty substrate integrated waveguide (ESIW) technology is recently receiving special attention, since it preserves the many advantages of SIW circuits but provides an enhanced behavior due to avoidance of dielectric filling. Many circuits have been designed in the ESIW technology, including several filters with different performances. The next challenge is to achieve the maximum possible compactness degree for these circuits. In this paper, we present the design of a multilayer empty substrate integrated filter with the same performance as if it were manufactured in a single layer but significantly increasing its compactness and mechanical resistance.

Recently, new methodologies for manufacturing empty waveguides completely integrated in a planar substrate have been proposed in order to improve the performance of substrate-integrated devices. One of these alternatives is the so-called empty substrate-integrated waveguide (ESIW). The height of high-frequency substrates, where ESIW devices are integrated, is very small. Then, the capacity of storing energy of ESIW resonators is drastically reduced, and as a result, their quality factor is not as high as it could be with a higher ESIW. In order to overcome this restriction, a novel integrated structure is proposed to embed very high-quality factor filters based on the ESIW with an increased height. As a result, we show, in this letter, for the first time, the successful integration of an increased-height ESIW filter in a printed circuit board of 0.305 mm height at Q-band, achieving a quality factor above 1000, which is a remarkable result for a completely substrate-integrated device operating in this frequency band. When compared with the same filter manufactured with an ESIW with the same height as the substrate, the novel filter shows a measured quality factor 85% higher.