Thermal barrier coatings (TBCs) are a fundamental technology used in high-temperature applications to protect superalloy substrate components. However, extreme high-temperature environments present many challenges for TBCs, such as the degradation of their thermal and mechanical properties. Hence, highly insulating, long-life TBCs must be developed to meet higher industrial efficiency. This paper reviews the main factors influencing the thermal insulation performance of TBCs, such as material, coating thickness, and structure. The heat transfer mechanism of the coating is summarized, and the degradation mechanism of the thermal insulation is analyzed from the perspective of the coating structure. Finally, the recent advances in improving the thermal insulation and lifetime of coatings are reviewed in terms of advanced materials and structural design, which will benefit advanced TBCs in future engineering applications and provide guidance for the next generation of high thermal insulating TBCs.
Thermal barrier coatings (TBCs) have been developed to protect superalloys against high-temperature heat fluxes, which are required for the development of high-performance gas turbines. TBCs have porous structures, which are densified by sintering. The resulting stiffening is a major cause of TBC failure in service. Therefore, there is a need to reduce the negative sintering effect on the life span of TBCs. In this study, the sintering mechanism and the dominant factors causing changes in stiffening and mechanical properties were revealed experimentally. The experimental results show that the multiscale undulation of the originally smooth two-dimensional (2D) pore inner surface triggers multipoint contact between the upper and lower inner surfaces, resulting in pore healing during thermal exposure. The healing of 2D pores is the main structural characteristic change in TBCs after thermal exposure and the main reason for the stiffening and changes in mechanical properties. Then, the sintering effect on TBCs with vertically cracked structures was designed and simulated. We found that implanting vertical cracks in the topcoat can reduce the sintering effect and driving force for cracking by 87.9% and 79.9%, respectively. The degree of reduction depends on the space between vertical cracks. Finally, the mechanism responsible for the sintering-resistant TBCs was analyzed and discussed. Vertically cracked structures exhibited scale-sensitive stiffening, indicating that macroscopic stiffening is much lower than microscopic stiffening. In other words, the macroscopic sintering effect was lowered, and the TBCs remained highly resistant to global strain during thermal exposure. The resulting strain energy release rates are much lower than those of conventional TBCs. The results of this study contribute to the long-life thermal protection of superalloy-based components used in advanced gas turbines.
Micro-arc Oxidation (MAO) is a technology for non-ferrous metal surface treatment through growth ceramic coating in situ. To determine the influence of the power supply mode and the loading parameters on the film forming of magnesium alloy micro-arc oxidation processing, the different power supply modes of pulsed direct current DC, pulsed bipolar current (BC) and the pulsed with a discharge loop current (DLC) was used with MAO technology on the AZ91D magnesium alloy. The power load parameters were optimized. The average energy consumption was calculated. Results showed that the role of the negative voltage in the bipolar pulse power supply is to restrain the large arc tendency. Under the pulse power supply with a discharge loop, the current and energy consumption decreases with the increase of the discharge resistance at the same pulse parameters. The big arc phenomenon can be effectively avoided and the impact of load capacitance could be effectively avoided by using the pulse power supply with a discharge loop. Moreover, the processing of the micro-arc oxidation is stable, the arc point is uniform, the surface of the film is smooth, the hole is uniform and the coating is dense, and the film efficiency is improved effectively.
The nucleation site plays a critical role in achieving the full coverage of perovskite film at both the macroscopic and microscopic scales, and it is systematically investigated for the first time in this study. The results show that under natural conditions, the incomplete coverage of perovskite film is due to both heterogeneous nucleation and homogeneous nucleation. The established concentration field and temperature field in the precursor solution show that there are two preferential nucleation sites, i.e., the upper surface of the precursor solution (homogeneous nucleation) and the surface of the substrate (heterogeneous nucleation). The nucleation sites are tuned by decreasing the drying pressure from the atmosphere to 3000 Pa, and then to 100 Pa, and then the microstructures of the perovskite films change from an incomplete coverage state to a monolayer full coverage state, and then to a bilayer full coverage state. At last, when the full coverage perovskite films are assembled into perovskite solar cells, the photovoltaic performance of the monolayer perovskite solar cells is slightly greater than that of the bilayer perovskite solar cells. The electrochemical characterization shows that there is more restrained internal recombination of the monolayer perovskite solar cells compared with bilayer perovskite solar cells.
A Finite-Element Model (FEM) for thermal-barrier coatings was employed to elaborate the temperature distribution on yttria-stabilized zirconia (YSZ) free surface during cracks coalescing, then the influence of sintering of YSZ induced by heat-transfer overlapping on energy release rate was quantificationally evaluated. A three-dimensional model including three layers was fabricated. Two types of cracks, with and without depth variations in YSZ coating, were introduced into the model, respectively. The temperature rise of YSZ coating over the crack is independent of each other at the beginning of crack propagation. As crack distance shortens, the independent temperature-rise regions begin to overlap, while maximum temperature is still located at the crack center before crack coalescence. The critical distance that the regions of temperature rise, just overlapping, is the sum of half lengths of two coalescing cracks (i.e., a1 + a2), which is independent of cracking path. The maximum temperature in YSZ sharply increases once cracks coalesce. Compared with one delamination crack, the effective energy-release rate induced by heat-transfer overlapping increases in the range of 0.2%–15%, depending on crack length and crack distance, which is on some level comparable to that of deterioration of thermal expansion misfit induced by temperature jump between crack faces.
The large-arc discharge problem occurs in the processing of magnesium alloy by micro-arc oxidation. It will cause local ablation of ceramic coating and even magnesium alloy matrix material. Thus, clarifying the mechanism and influencing factors is a necessary approach to avoid the large-arc discharge problem. In this study, a new “cooling time” parameter based on frequency and duty cycle is proposed to study the large-arc discharge trend and understand the relationship between large-arc discharge and process parameters. Then, the mechanism of the large-arc discharge phenomenon and the action of the cooling time were investigated by the theory of local-arc discharge mechanism and load characteristics of micro-arc oxidation. The results show that the mechanism of large-arc discharge is that the arc discharge is continuous in situ, and the aggregation or merger of arc discharge occurrence. Therefore, the large-arc problem can be resolved effectively through discretizing the arc discharge by adjusting the cooling time and regulating the pulse frequency and duty cycle. The cooling time made the location area of arc discharge and oxides fully cooled, and provided time for the sufficient discharge of the load capacitance, to effectively inhibit the problem of large-arc discharge.