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Dr. Xing Fu

School of Electronics and Information, South China University of Technology
+ 1
  • China Science and Technology On Reliability Physics and Application of Electroni...

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0000-0001-9894-5130

Research Keywords & Expertise

Electromigration
Grain boundary
intermetallic compound...
in-situ EBSD
grain rotation

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40%
Electromigration
40%
intermetallic compounds
27%
Grain boundary
7%
grain rotation
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