With the growth of the manufacturing industry, the demand for alloy materials with high hardness, toughness, and impact strength has increased. Since products from such alloy materials are extremely difficult to manufacture with high accuracy and reduced surface roughness using traditional machining techniques, wire electric discharge machining can be used to machine such complex parts with more precision. In this case-study-based research, machining factors such as current, pulse-on time, and voltage are studied to determine their effects on the material removal rate for AISI 1045 medium carbon steel. The Taguchi L₉ orthogonal array is used in the design of experiments for optimization. Statistical techniques such as analysis of variance and signal-to-noise ratio are used to identify the control parameters that matter most in bringing about optimal results. Based on the results, the current is the most crucial control variable in this investigation. Moreover, the maximum material removal rate obtained was 0.7112 mm³/min with the obtained optimized values of current (I) = 16 A, voltage (V) = 50 V, and pulse-on time (Ton) = 100 µs.

Stereolithography additive manufacturing (SLA-AM) can be used to produce ceramic structures by selectively curing a photosensitive resin that has ceramic powder in it. The photosensitive resin acts as a ceramic powder binder, which is burned, and the remaining ceramic part is sintered during post-processing using a temperature–time-controlled furnace. Due to this process, the ceramic part shrinks and becomes porous. Moreover, additive manufacturing leads to the orthotropic behavior of the manufactured parts. This article studies the effect of the manufacturing orientation of ceramic parts produced via SLA-AM on dimensional accuracy. Scaled CAD models were created by including the calculated shrinkage factor. The dimensions of the final sintered specimens were very close to the desired dimensions. As sintering induces porosity and reduces the mechanical strength, in this study, the effect of orientation on strength was investigated, and it was concluded that the on-edge specimen possessed by far the highest strength in terms of both compression and tension.

Oxygen-rich SiAlON ceramics doped with various nanosized metal oxide (MO) stabilizers were synthesized with a view to examine their effect on thermal and mechanical characteristics. The nanosized starting powder precursors comprising Si₃N₄, AlN, Al₂O₃, and SiO₂ along with oxides of Ba, Y, Mg, La, Nd, Eu, Dy, Er, and Yb as the MO charge stabilizer were employed in developing different SiAlON samples. Ultrasonic probe sonication was utilized to develop a homogenous mixture of initial powder precursors followed by spark plasma sintering (SPS) of the samples at the low temperature of 1500 °C coupled with 30 min of isothermal treatment. Sample compositions (according to general formula of alpha SiAlON: M_m/v^v+Si_12−(m+n)Al_m+nO_nN_16−n) selected in the present study are represented by m value of 1.1 and n value of 1.6. The synthesized samples were evaluated for their physical behavior, microstructural and crystal structure evolution, and thermal and mechanical characteristics. More specifically, the sintered ceramics were examined by X-ray diffraction and electron microscopy to comprehend and relate the structural characteristics with the densification, thermal conductivity, hardness, and fracture toughness. The high reactivity of the nanopowders and the localized heating provided by SPS resulted in densified ceramics with relative densities in the range of 92–96%. Vickers hardness values were found to be in the range of 12.4–17.0 GPa and were seen to be profoundly influenced by the grain size of the alpha SiAlON (primary) phase. The fracture toughness of the samples was measured to be in the range of 4.1–6.2 MPa·m^1/2. SiAlON samples synthesized using Er and Yb charge stabilizers were found to have the highest fracture toughness of 5.7 and 6.2 MPa·m^1/2, primarily due to the relatively higher content of the elongated beta phase. While there was no obvious relationship between the thermal conductivity and the alpha SiAlON metal charge stabilizers, the values were seen to be influenced by the grain size of alpha phase where Dy-SiAlON had the lowest thermal conductivity of 5.79 W/m⋅K and Er-SiAlON showed the highest value of thermal conductivity (6.91 W/m⋅K). It was concluded that scientifically selected metal oxide charge stabilizers are beneficial in developing SiAlON ceramics with properties tailored according to specific applications.

Due to the miniaturization of electronic devices, electromigration became one of the serious reliability issues in lead-free solder joints. The orientation of the β-Sn grain plays an important role in electromigration failures. Several studies have been carried out to investigate the effect of Sn grain orientation on electromigration. The efforts involve the influence of β-Sn grain orientation on the migration of Cu, Sn, and Ni atoms, on the morphology of the solder joint, and on the formation of Cu6Sn5 and (Cu, Ni)6Sn6 in the lead-free solder joint during electromigration. The current review provides a detailed review of past studies which were conducted to investigate the influence of β-Sn grain orientation on electromigration failures in lead-free solder joints.