A laser lift-off (LLO) process has been developed for detaching thin InGaN/GaN lightemitting diodes (LED) from their original sapphire substrates by applying an ultrafast laser. LLO is usually based on intense UV irradiation, which is transmitted through the sapphire substrate and subsequently absorbed at the interface to the epitaxially grown GaN stack. Here, we present a successful implementation of a two-step LLO process with 350 fs short pulses in the green spectral range (520 nm) based on a two-photon absorption mechanism. Cathodo- and electroluminescence experiments have proven the functionality of the LLO-based chips. The impact of radiation on the material quality was analysed with scanning (SEM) and transmission electron microscopy (TEM), revealing structural modifications inside the GaN layer in some cases.

The recent advances in chip-size microscopy based on optical scanning with spatially resolved nano-illumination light sources are presented. This new straightforward technique takes advantage of the currently achieved miniaturization of LEDs in fully addressable arrays. These nano-LEDs are used to scan the sample with a resolution comparable to the LED sizes, giving rise to chip-sized scanning optical microscopes without mechanical parts or optical accessories. The operation principle and the potential of this new kind of microscope are analyzed through three different implementations of decreasing LED dimensions from 20 µm down to 200 nm.

Transferable substrate-less InGaN/GaN light-emitting diode (LED) chips have successfully been fabricated in a laser lift-off (LLO) process employing high power ultrashort laser pulses with a wavelength of 520 nm. The irradiation of the sample was conducted in two sequential steps involving high and low pulse energies from the backside of the sapphire substrate, which led to self-detachment of the GaN stack layer without any additional tape release procedure. To guarantee their optoelectrical function and surface quality, the lifted LED chips were assessed in scanning electron microscopy (SEM) and electroluminescence (EL) measurements. Moreover, surface characterizations were done using atomic force microscopy (AFM) and Auger Electron Spectroscopy (AES).