This work mainly focuses on a series of microstructural analysis and predictions regarding dynamic recrystallization behavior, change in grain size, and dislocation density. Additionally, this study includes the shape prediction of the stir zone formed during friction stir spot welding. Microstructure analysis of the joint reveals that the mechanism of dynamic recrystallization in the stir zone is geometric dynamic recrystallization. A set of constitutive equations based on dislocation density is established and implemented in DEFORM-3D software to predict dynamic recrystallization during friction stir spot welding of AA6082. From the experimental and model predictions, it is observed that the original microstructure in the stir zone is completely replaced by a recrystallized fine grained microstructure. There is satisfactory agreement between the experimental grain size and the simulated results. In addition, the predicted shape of the stir zone fits quite well with the experimental shape as well.

The low temperature sealing of Kovar alloy to DM305 electronic glass was realized by using lead-free glass solder of the Bi₂O₃-ZnO-B₂O₃ system in atmospheric environment. The sealing process was optimized by pre-oxidation of Kovar alloy and low temperature founding of flake glass solder. The effects of sealing temperature and holding time on the properties of sealing joint were studied by means of X-ray diffraction (XRD), scanning electron microscope (SEM), energy dispersive X-ray spectroscopy (EDS), etc. The results showed that the pre-oxidized Kovar alloy and DM305 electronic glass were successfully sealed with flake glass solder at the sealing temperature of 500 °C for 20 min. Meanwhile, the joint interface had no pores, cracks, and other defects, the shear strength was 12.24 MPa, and the leakage rate of air tightness was 8 × 10⁻⁹ Pa·m³/s. During the sealing process, element Bi in glass solder diffused into the oxide layer of Kovar alloy and DM305 electronic glass about 1 μm, respectively.

A new method for flux-free diffusion joining of aluminum matrix composites reinforced with SiC particles (SiC_p/Al MMCs) in atmosphere environment has been developed. Liquid gallium and nano-copper particles were employed as filler metal under joining temperatures ranging between 400 °C to 480 °C, with a holding time of 2 h and pressure of 3 MPa. The results showed that 65 vol.% SiC_p/6063 Al MMCs were successfully joined together. X-ray diffraction (XRD) analysis confirmed the presence of Ga₂O₃ at the fracture. Meanwhile, neither copper oxide nor aluminum oxide was detected. The formation of Ga₂O₃ can protect nano-copper particles and SiC_p/6063 Al MMCs from oxidation. The width of weld seam tended to be narrowed from 40 μm to 14 μm gradually with increasing temperature from 400 °C to 480 °C. The maximum shear strength level of 41.2 MPa was achieved with a bonding temperature of 450 °C. The change of the strength was due to the adequate elements’ mutual diffusion and solution, as well as the change of the quantity and morphology of intermetallic compounds in the weld seam, such as Al₂Cu and Cu₃Ga. When the diffusion joining temperature reached 440 °C or above, the leak rate of the specimen remained under 10⁻¹⁰ Pa·m³/s.

The joining methods of Aluminum matrix composites reinforced with SiC particles (SiC_p/Al MMCs) are a challenge during the manufacturing process due to the significant differences between SiC particles and base aluminum in terms of both physical and chemical properties. Micro-nano brazing filler metal Al-17.0Cu-8.0Mg fabricated by melt-spinning technology was employed to deal with the joining problem of 55 vol.% SiC_p/ZL102 composites in this work. The result indicated that the foil-like brazing filler metal contained uniformed cellular nano grains, with a size less than 200 nm. The solidus and liquidus temperatures of the foil-like brazing filler metal decreased by 4 °C and 7 °C in comparison with the values of the as-cast brazing filler metal due to the nanometer size effect. The maximum joint shear strength of 98.17 MPa achieved with a brazing temperature of 580 °C and holding time of 30 min was applied in vacuum brazing process. The width of the brazing seam became narrower and narrower with increasing brazing temperature owning to the strong interaction between the micro-nano brazing filler metal and 55 vol.% SiC_p/ZL102 composites. The fracture morphology of the joint made at a brazing temperature of 580 °C was characterized by quasi-cleavage fracture. After brazing, the chemical concentration gradient between the brazing filler metal and base material disappeared.

The vacuum brazing of dissimilar electronic packaging materials has been investigated. In this research, this applies silicon particle-reinforced aluminum matrix composites (Si_p/Al MMCs) to Kovar alloys. Active melt-spun ribbons were employed as brazing filler metals under different joining temperatures and times. The results showed that the maximum joint shear strength of 96.62 MPa was achieved when the joint was made using Al-7.5Si-23.0Cu-2.0Ni-1.0Ti as the brazing filler metal at 580 °C for 30 min. X-ray diffraction (XRD) analysis of the joint indicated that the main phases were composed of Al, Si and intermetallics, including CuAl, TiFeSi, TiNiSi and Al₃Ti. When the brazing temperature ranged from 570 °C to 590 °C, the leakage rate of joints remained at 10⁻⁸ Pa·m³/s or better. When the joint was made using Al-7.5Si-23.0Cu-2.0Ni-2.5Ti as the brazing filler metal at 580 °C for 30 min, the higher level of Ti content in the brazing filler metal resulted in the formation of a flake-like Ti(AlSi)₃ intermetallic phase with an average size of 7 µm at the interface between the brazing seam and Si_p/Al MMCs. The joint fracture was generally in the form of quasi-cleavage fracture, which primarily occurred at the interface between the filler metal and the Si_p/Al MMCs. The micro-crack propagated not only Ti(AlSi)₃, but also the Si particles in the substrate.