Thin film stacks consisting of multiple repeats M of synthetic antiferromagnetic (SAF) [Co/Pd]_N/Ru/[Co/Pd]_N units with perpendicular magnetic anisotropy were explored as potential starting materials to fabricate free-standing micro/nanodisks, which represent a promising candidate system for theranostic applications. The films were directly grown on a sacrificial resist layer spin-coated on SiO_x/Si(100) substrates, required for the preparation of free-standing disks after its dissolution. Furthermore, the film stack was sandwiched between two Au layers to allow further bio-functionalization. For M ≤ 5, the samples fulfill all the key criteria mandatory for biomedical applications, i.e., zero remanence, zero field susceptibility at small fields and sharp switching to saturation, together with the ability to vary the total magnetic moment at saturation by changing the number of repetitions of the multi-stack. Moreover, the samples show strong perpendicular magnetic anisotropy, which is required for applications relying on the transduction of a mechanical force through the micro/nano-disks under a magnetic field, such as the mechanical cell disruption, which is nowadays considered a promising alternative to the more investigated magnetic hyperthermia approach for cancer treatment. In a further step, SAF microdisks were prepared from the continuous multi-stacks by combining electron beam lithography and Ar ion milling, revealing similar magnetic properties as compared to the continuous films.

This paper presents the development of a multi-hinge, multi-DoF (Degrees of Freedom) nanogripper actuated by means of rotary comb drives and equipped with CSFH (Conjugate Surface Flexure Hinges), with the goal of performing complex in-plane movements at the nanoscale. The design approach, the simulation and a specifically conceived single-mask fabrication process are described in detail and the achieved results are illustrated by SEM images. The first prototype presents a total overall area of (550 × 550) $\mathsf{\mu }$$m^2$, an active clamping area of (2 × 4) $\mathsf{\mu }$$m^2$, 600 nm-wide circular curved beams as flexible hinges for its motion and an aspect ratio of about 2.5. These features allow the proposed system to grasp objects a few hundred nanometers in size.

The evolution of microelectronic technologies is giving constant impulse to advanced micro-scaled systems which perform complex operations. In fact, the actual micro and nano Electro-Mechanical Systems (MEMS/NEMS) easily integrate information-gathering and decision-making electronics together with all sorts of sensors and actuators. Mechanical manipulation can be obtained through microactuators, taking advantage of magnetostrictive, thermal, piezoelectric or electrostatic forces. Electrostatic actuation, more precisely the comb-drive approach, is often employed due to its high versatility and low power consumption. Moreover, the device design and fabrication process flow can be simplified by compliant mechanisms, avoiding complex elements and unorthodox materials. A nano-scaled rotary comb drive is herein introduced and obtained using NEMS technology, with an innovative design which takes advantages of the compliant mechanism characteristics. A theoretical and numerical study is also introduced to inspect the electro-mechanical behavior of the device and to describe a new technological procedure for its fabrication.

We demonstrate a rectification mechanism based on quantum tunneling through the narrow Schottky barrier of a sub-micrometric Au/Ti/n-GaAs junction, which is capable of efficient power detection of free-space terahertz radiation beams even without an applied dc bias. Three-dimensional shaping of the junction geometry provides an enhanced zero-bias tunneling probability due to increased electric fields at the junction, resulting in cutoff frequencies up to 0.55 THz, responsivity up to 200 V/W, and noise equivalent power better than 10⁻⁹ W/Hz^0.5 without applied dc bias.

Downscaling has been a focal task of Electronics and Electromechanics in the last few decades, and a great engine for technological progress as well. Nevertheless, a scaling operation affects device physics, functioning and performance. The present paper investigates about the impact of scaling on a test case compliant electrostatic micro or nano actuator that is under development with two preferred micro fabrication methods, namely, thick SOI and thin amorphous silicon. A series of numerical trials on materials strength, electro-mechanical characteristics, sensitivity and overall actuation performance have been carried out at different grades of down-scaling and of aspect ratio. This gave rise to new design charts that we propose here as a predictive and friendly guide to select the most appropriate micro fabrication method.

Although some recent developments in nanotechnology made the prospects of a direct mechanical manipulation of micro- or nano-objects quite realistic, there are still several concerns and difficulties that affect such an endeavor. This is probably due to the large base of knowledge that is necessary to approach the problem of handling a nano-object by means of a nano- or micro-device. Therefore, any progress in this field is possible only by means of an integrated and interdisciplinary approach, which takes into account different aspects of the phenomenon. During the actual pioneering phase, there is a certain convenience in handling nano-objects that: (a) have peculiar known characteristics; (b) are easily recognizable, and (c) are interesting to the scientific community. This paper presents the interdisciplinary activities that were necessary to set up an experiment where specifically synthesized SiO₂ particles came in contact with the tips of specifically-designed and -fabricated nanomanipulators. SiO₂ mesoporous nanoparticles (KCC-1), having a peculiar dendritic structure, have been selected as a suitable nano-object because of the possibility to easily modulate their morphology. The expected contact force has been also calculated by means of Finite Element Analysis (FEA) electro-mechanical simulations.