Memristive devices, which combine a resistor with memory functions such that voltage pulses can change their resistance (and hence their memory state) in a nonvolatile manner, are beginning to be implemented in integrated circuits for memory applications. However, memristive devices could have applications in many other technologies, such as non–von Neumann in-memory computing in crossbar arrays, random number generation for data security, and radio-frequency switches for mobile communications. Progress toward the integration of memristive devices in commercial solid-state electronic circuits and other potential applications will depend on performance and reliability challenges that still need to be addressed, as described here.

Resistive switching (RS) is an interesting property shown by some materials systems that, especially during the last decade, has gained a lot of interest for the fabrication of electronic devices, with electronic nonvolatile memories being those that have received the most attention. The presence and quality of the RS phenomenon in a materials system can be studied using different prototype cells, performing different experiments, displaying different figures of merit, and developing different computational analyses. Therefore, the real usefulness and impact of the findings presented in each study for the RS technology will be also different. This manuscript describes the most recommendable methodologies for the fabrication, characterization, and simulation of RS devices, as well as the proper methods to display the data obtained. The idea is to help the scientific community to evaluate the real usefulness and impact of an RS study for the development of RS technology.

In this paper, we investigate the random telegraph noise (RTN) in hafnium-oxide resistive random access memories in high resistive state (HRS). The current fluctuations are analyzed by decomposing the multilevel RTN signal into two-level RTN traces using a factorial hidden Markov model approach, which allows extracting the properties of the traps originating the RTN. The current fluctuations, statistically analyzed on devices with a different stack reset at different voltages, are attributed to the activation and deactivation of defects in the oxidized tip of the conductive filament, assisting the trap-assisted tunneling transport in HRS. The physical mechanisms responsible for the defect activation are discussed. We find that RTN current fluctuations can be due to either the coulomb interaction between oxygen vacancies (normally assisting the charge transport) and the electron charge trapped at interstitial oxygen defects, or the metastable defect configuration of oxygen vacancies assisting the electron transport in HRS. A consistent microscopic description of the phenomenon is proposed, linking the material properties to the device performance.

We present a simple empirical expression describing hafnium-based RRAM resistance at different reset voltages and current compliances. The model that we propose describes filament resistance measured at low ( ~ 0.1 V) reading voltage in both low-resistance state (LRS) and high-resistance state (HRS). The proposed description confirms that conduction in LRS is ohmic (after forming with a sufficiently high current compliance) and is consistent with the earlier description of HRS resistance as controlled by a trap-assisted electron transfer via traps in the oxidized portion of the filament. The length of the nonohmic part of the filament is found to be directly proportional to reset voltage. Moreover, low-frequency noise measurements at different reset voltages evidence a tradeoff between HRS resistance and noise in reading conditions.

Ferroelectric transistors (FeFETs) based on doped hafnium oxide (HfO $_{\text{2}}$ ) have received much attention due to their technological potential in terms of scalability, high-speed, and low-power operation. Unfortunately, however, HfO $_{\text{2}}$ -FeFETs also suffer from persistent reliability challenges, specifically affecting retention, endurance, and variability. A deep understanding of the reliability physics of HfO $_{\text{2}}$ -FeFETs is an essential prerequisite for the successful commercialization of this promising technology. In this article, we review the literature about the relevant reliability aspects of HfO $_{\text{2}}$ -FeFETs. We initially focus on the reliability physics of ferroelectric capacitors, as a prelude to a comprehensive analysis of FeFET reliability. Then, we interpret key reliability metrics of the FeFET at the device level (i.e., retention, endurance, and variability) based on the physical mechanisms previously identified. Finally, we discuss the implications of device-level reliability metrics at both the circuit and system levels. Our integrative approach connects apparently unrelated reliability issues and suggests mitigation strategies at the device, circuit, or system level. We conclude this article by proposing a set of research opportunities to guide future development in this field.