Wafer maps contain information about defects and clustered defects that form failure patterns. Failure patterns exhibit the information related to defect generation mechanisms. The accurate classification of failure patterns in wafer maps can provide crucial information for engineers to recognize the causes of the fabrication problems. In this paper, we proposed a decision tree ensemble learning-based wafer map failure pattern recognition method based on radon transform-based features. Radon transform is applied on raw wafer map data to generate the new features which are exhibiting the geometric information of failure patterns in wafer map. Decision tree algorithm is applied to build decision tree ensemble and the final decision is made by aggregating the prediction results of decision trees. The effectiveness of the proposed method has been verified by using the real world wafer map data set (WM-811K).

The Internet of Things (IoT) is the global network of interrelated physical devices such as sensors, actuators, smart applications, objects, computing devices, mechanical machines, and people that are becoming an essential part of the internet. In an industrial environment, these devices are the source of data which provide abundant information in manufacturing processes. Nevertheless, the massive, heterogeneous, and time-sensitive nature of the data brings substantial challenges to the real-time collection, processing, and decision making. Therefore, this paper presents a framework of an IoT-based Industrial Data Management System (IDMS) which can manage the huge industrial data, support online monitoring, and control smart manufacturing. The framework contains five basic layers such as physical, network, middleware, database, and application layers to provide a service-oriented architecture for the end users. Experimental results from a smart factory case study demonstrate that the framework can manage the regular data and urgent events generated from various factory devices in the distributed industrial environment through state-of-the-art communication protocols. The collected data is converted into useful information which improves productivity and the prognosis of production lines.

Defective die on a wafer map tend to cluster in distinguishable patterns, and such defect patterns can provide crucial information to identify equipment problems or process failures in the semiconductor manufacturing. Therefore, it is important to accurately and efficiently classify the defect patterns. In this research, we propose a novel clustering-based defect pattern detection and classification framework for wafer bin map. The proposed framework has many advantages. Outlier detection and defect cluster pattern extraction can be done at the same time; arbitrarily shaped cluster patterns can be detected; and there is no need to specify the number of clusters in advance. Based on wafer bin map property, the parameters used in the clustering algorithm are fixed so that parameter sensitivity can be avoided. Since the defect patterns are classified based on extracted features, no labeled data and no supervised classification training are needed and single-type patterns as well as mixed-type patterns can be found. Extensive experiments conducted on a real-world WM-811K dataset has shown the superiority of proposed framework. The proposed framework can also be used in a big data environment to accelerate performance.

In this paper, we proposed not only an extraction methodology of multiple feature vectors from ultrasound images for carotid arteries (CAs) and heart rate variability (HRV) of electrocardiogram signal, but also a suitable and reliable prediction model useful in the diagnosis of cardiovascular disease (CVD). For inventing the multiple feature vectors, we extract a candidate feature vector through image processing and measurement of the thickness of carotid intima-media (IMT). As a complementary way, the linear and/or nonlinear feature vectors are also extracted from HRV, a main index for cardiac disorder. The significance of the multiple feature vectors is tested with several machine learning methods, namely Neural Networks, Support Vector Machine (SVM), Classification based on Multiple Association Rule (CMAR), Decision tree induction and Bayesian classifier. As a result, multiple feature vectors extracted from both CAs and HRV (CA+HRV) showed higher accuracy than the separative feature vectors of CAs and HRV. Furthermore, the SVM and CMAR showed about 89.51% and 89.46%, respectively, in terms of diagnosing accuracy rate after evaluating the diagnosis or prediction methods using the finally chosen multiple feature vectors. Therefore, the multiple feature vectors devised in this paper can be effective diagnostic indicators of CVD. In addition, the feature vector analysis and prediction techniques are expected to be helpful tools in the decisions of cardiologists.