As the IV generation of packaging, biopolymers, with the advantages of biodegradability, process ability, combination possibilities and no pollution to food, have become the leading food packaging materials. Biopolymers can be directly extracted from biomass, synthesized from bioderived monomers and produced directly by microorganisms which are all abundant and renewable. The raw materials used to produce biopolymers are low-cost, some even coming from agrion dustrial waste. This review summarized the advances in protein-based films and coatings for food packaging. The materials studied to develop protein-based packaging films and coatings can be divided into two classes: plant proteins and animal proteins. Parts of proteins are referred in this review, including plant proteins i.e., gluten, soy proteins and zein, and animal proteins i.e., casein, whey and gelatin. Films and coatings based on these proteins have excellent gas barrier properties and satisfactory mechanical properties. However, the hydrophilicity of proteins makes the protein-based films present poor water barrier characteristics. The application of plasticizers and the corresponding post-treatments can make the properties of the protein-based films and coatings improved. The addition of active compounds into protein-based films can effectively inhibit or delay the growth of microorganisms and the oxidation of lipids. The review also summarized the research about the storage requirements of various foods that can provide corresponding guidance for the preparation of food packaging materials. Numerous application examples of protein-based films and coatings in food packaging also confirm their important role in food packaging materials.

With the continuous increase in the production of electronic devices, large amounts of electronic waste (E-waste) are routinely being discarded into the environment. This causes serious environmental and ecological problems because of the non-degradable polymers, released hazardous chemicals, and toxic heavy metals. The appearance of biodegradable polymers, which can be degraded or dissolved into the surrounding environment with no pollution, is promising for effectively relieving the environmental burden. Additionally, biodegradable polymers are usually biocompatible, which enables electronics to be used in implantable biomedical applications. However, for some specific application requirements, such as flexibility, electric conductivity, dielectric property, gas and water vapor barrier, most biodegradable polymers are inadequate. Recent research has focused on the preparation of nanocomposites by incorporating nanofillers into biopolymers, so as to endow them with functional characteristics, while simultaneously maintaining effective biodegradability and biocompatibility. As such, bionanocomposites have broad application prospects in electronic devices. In this paper, emergent biodegradable and biocompatible polymers used as insulators or (semi)conductors are first reviewed, followed by biodegradable and biocompatible nanocomposites applied in electronics as substrates, (semi)conductors and dielectrics, as well as electronic packaging, which is highlighted with specific examples. To finish, future directions of the biodegradable and biocompatible nanocomposites, as well as the challenges, that must be overcome are discussed.

In the context of protecting the ecological environment and carbon neutrality, high-value recycling of flexible polyurethane foam (F-PUF) scraps, generated in the production process, is of great significance to save petroleum raw materials and reduce energy consumption. In the present study, F-PUF scraps were ground into powder by strong shear regrinding using two-roll mill and then reused as a partial replacement of polyol for re-foaming. A series of characterizations were employed to investigate the effect of milling cycles, roller temperatures, and content of the powder on the properties of the powder and F-PUF containing powder. It was revealed that the mechanochemical effect induced breaking of the cross-linking structure and increased activity of the powder. The volume mean diameter (VMD) of powder prepared with 7 milling cycles, at room temperature, is about 97.73 μm. The microstructure and density of the F-PUF containing powder prepared in the above-mentioned manner to replace up to 15 wt.% polyol, is similar to the original F-PUF, with resilience 49.08% and compression set 7.8%, which indicates that the recycling method will play an important role in industrial applications.